Fabrication process and interfacial study of high-Tc Josephson junctions fabricated using the focused ion beam technique

被引：6

作者：

Morohashi, S ^{[1
]}

Wen, JG ^{[1
]}

Enomoto, Y ^{[1
]}

Koshizuka, H ^{[1
]}

机构：

[1] Int Superconduct Technol Ctr, Superconduct Res Lab, Koto Ku, Tokyo 135, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1999年 / 38卷 / 2A期

关键词：

high-T-c Josephson junction; focused ion beam (FIB) technique; grain boundary junction; bridge junction; proximity effect;

D O I：

10.1143/JJAP.38.698

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We describe the fabrication processes of high-T-c Josephson junctions fabricated using the focused ion beam (FIB) technique. and the junction interfaces using cross-sectional transmission electron microscopy. This FIB technique has the two functions of etching and deposition. Using each of the FIB functions independently, and also together, we have fabricated junctions with three types of structures. The two types of junctions fabricated using each of the FIB functions independently are classified as grain boundary junctions with multi-grain boundaries, and the junction fabricated using both RE functions is a proximity-effect type junction.

引用

页码：698 / 706

页数：9

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