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Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module
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2015 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM,
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Signal Integrity Problems in the Design of High-Speed Serial Communication Devices
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TSP 2010: 33RD INTERNATIONAL CONFERENCE ON TELECOMMUNICATIONS AND SIGNAL PROCESSING,
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