Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization

被引：15

作者：

Cai, Wen-Ran ^{[1
,2
]}

Chen, Yan-Qiu ^{[3
]}

Liu, Yu ^{[1
,4
]}

Jin, Xiong ^{[5
]}

Deng, Yong-Qiang ^{[5
]}

Zhang, Yong-Zhe ^{[2
]}

Zhang, Jie ^{[6
]}

Yan, Hui ^{[2
]}

Gao, Wei-Lian ^{[3
]}

Mei, Jun ^{[5
]}

Lau, Woon-Ming ^{[7
]}

机构：

[1] Jiangnan Univ, Sch Mech Engn, Wuxi 214122, Peoples R China

[2] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

[3] Jiangnan Univ, Inst Precis Intelligent Syst Engn, Sch Mech Engn, Wuxi 214122, Peoples R China

[4] Jiangnan Univ, Jiangsu Key Lab Adv Food Mfg Equipment & Technol, Wuxi 214122, Peoples R China

[5] Chengdu Green Energy & Green Mfg Technol Res & De, Chengdu 610200, Sichuan, Peoples R China

[6] Changzhou Inst Printed Elect Ind, Changzhou 213000, Peoples R China

[7] Univ Sci & Technol Beijing, Sch Math & Phys, Beijing 100083, Peoples R China

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2017年 / 7卷 / 09期

基金：

中国国家自然科学基金;

关键词：

Electroless copper metallization; flexible electronics; inkjet printing; SILVER NANOPARTICLES; ROOM-TEMPERATURE; THIN-FILM; PATTERNS; POLYIMIDE; SURFACE; STABILITY; CONDUCTIVITY; DEPOSITION; ROUTE;

D O I：

10.1109/TCPMT.2017.2730483

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thin film electrodes on a flexible substrate have attracted significant interests from the community for developing flexible and wearable electronics. A prompted routine for inkjet printing conductive patterns on a flexible plastic substrate is developed in this study, in which silver ion-based catalytic ink is utilized as a seed layer for electroless copper metallization in room temperature. Through optimization of Ag+ ink composition and printing process parameters, the pattern definition and continuity of electroless plated Cu have been improved. The resistivity at the same order of 10(-6) Omega cm as bulk copper is achieved, and the adhesion has passed a variety of mechanical tests. Comprehensive characterizations of the printed samples at various processing stages are carried out and presented in this paper.

引用

页码：1552 / 1559

页数：8

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