Advances in SiGe HBT BiCMOS technology

被引:0
|
作者
Joseph, A [1 ]
Lanzerotti, L [1 ]
Liu, X [1 ]
Sheridan, D [1 ]
Johnson, J [1 ]
Liu, Q [1 ]
Dunn, J [1 ]
Rieh, JS [1 ]
Harame, D [1 ]
机构
[1] IBM Corp, Microelect Div, Semicond Res & Dev Ctr, Essex Jct, VT 05452 USA
关键词
SiGeHBT; bipolar; BiCMOS technologies;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Silicon Germanium (SiGe) Heterojunction Bipolar Transistor (HBT) BiCMOS technology has established a strong foothold in the communication marketplace by offering a cost competitive solution for myriad of products. SiGe BiCMOS technologies currently address various applications ranging from 0.9 - 77 GHz. At the heart of this success is the ease of integration of a high performance SiGe HBT with the state-of-the-art CMOS and passive elements. Here, we present the advances in SiGe BiCMOS technologies and an outlook of future challenges and opportunities.
引用
收藏
页码:1 / 4
页数:4
相关论文
共 50 条
  • [41] Microwave VCO susceptibility to substrate noise in a fully-integrated 150 GHz SiGe HBT BiCMOS technology
    Comeau, JP
    Cressler, JD
    2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, 2005, : 2235 - 2238
  • [42] Flicker Noise Comparison of Direct Conversion Mixers using Schottky and HBT Dioderings in SiGe: C BiCMOS Technology
    Michaelsen, Rasmus S.
    Johansen, Tom K.
    Tamborg, Kjeld
    Squartecchia, Michele
    2015 INTEGRATED NONLINEAR MICROWAVE AND MILLIMETRE-WAVE CIRCUITS WORKSHOP (INMMIC), 2015,
  • [43] The effect of 63 MeV hydrogen ion irradiation on 65 GHz UHV/CVD SiGe HBT BiCMOS technology
    Prakash, A. P. Gnana
    Cressler, John D.
    RADIATION EFFECTS AND DEFECTS IN SOLIDS, 2011, 166 (8-9): : 703 - 709
  • [44] Advances in foundry SiGe HBT BiCMOS processes through modeling and device scaling for ultra-high speed applications
    Phillips, S.
    Preisler, E.
    Zheng, J.
    Chaudhry, S.
    Racanelli, M.
    Mueller, M.
    Schroeter, M.
    McArthur, W.
    Howard, D.
    2021 IEEE BICMOS AND COMPOUND SEMICONDUCTOR INTEGRATED CIRCUITS AND TECHNOLOGY SYMPOSIUM (BCICTS), 2021,
  • [45] LDMOSFET and SiGe:C HBT integrated in a 0.25μm BiCMOS technology for RF-PA applications.
    Muller, D
    Giry, A
    Arnaud, C
    Arricastres, C
    Sommet, R
    Szelag, B
    Monroy, A
    Pache, D
    PROCEEDING OF THE 2004 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 2004, : 168 - 171
  • [46] Investigating the differences in low-frequency noise behavior of npn and pnp SiGe HBTs fabricated in a complementary SiGe HBT BiCMOS on SOI technology
    Zhao, E
    Krithivasan, R
    Sutton, AK
    Jin, ZR
    Cressler, JD
    El-Kareh, B
    Balster, S
    Yasuda, H
    NOISE IN DEVICES AND CIRCUITS III, 2005, 5844 : 132 - 142
  • [47] Integration of a 50 V BVCEO SiGe:C HBT into a 0.25 μm SiGe:C BiCMOS Platform
    Sorge, R.
    Schmidt, J.
    Wipf, Ch
    Korndoerfer, F.
    Pliquett, R.
    Schulz, K.
    Barth, R.
    2014 IEEE 14TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), 2014, : 89 - 91
  • [48] Transistor noise in SiGe HBT RF technology
    Niu, GF
    Cressler, JD
    Jin, ZR
    Zhang, SM
    Juraver, JB
    Borgarino, M
    Plana, R
    Llopis, O
    Webster, C
    Joseph, AJ
    PROCEEDINGS OF THE 2000 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 2000, : 207 - 210
  • [49] Half-Terahertz SiGe BiCMOS Technology
    Ruecker, H.
    Heinemann, B.
    Fox, A.
    2012 IEEE 12TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), 2012, : 133 - 136
  • [50] A Terahertz Detector Array in a SiGe HBT Technology
    Al Hadi, Richard
    Grzyb, Janusz
    Heinemann, Bernd
    Pfeiffer, Ullrich R.
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2013, 48 (09) : 2002 - 2010