Cross testing electrically conductive adhesives and conductive back-sheets for the ECN back-contact cell and module technology

被引:8
作者
Broek, K. M. [1 ]
Bennett, I. J. [1 ]
Kloos, M. J. H. [1 ]
Eerenstein, W. [1 ]
机构
[1] ECN, NL-1755 ZG Petten, Netherlands
来源
PROCEEDINGS OF THE FIFTH WORKSHOP ON METALLIZATION FOR CRYSTALLINE SILICON SOLAR CELLS | 2015年 / 67卷
关键词
Electrically conductive adhesives; ECA; conductive back-sheet foil; CBS; back-contact; MWT; durability testing;
D O I
10.1016/j.egypro.2015.03.301
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
ECN set up a cross testing project in which suppliers of electrically conductive adhesives (ECA) and conductive back-sheet (CBS) foils participated. In the component part of the project, combinations of adhesive and foil were characterised for peel strength and contact resistance. The separate components were tested on dot geometry (ECA) and surface structure (CBS). In the module manufacture and testing part, 12 combinations of ECA and CBS were used in 4-cell MWT modules. The modules were tested up to 2000 hours in damp heat and 400 thermal cycles (both tests, 2 times the requirement of IEC61215). Most combinations passed the 5% power loss criterion. One of the conductive adhesives performed well on three different types of back-sheet which is supportive of a robust technology. Other results show that it is important to thoroughly test interesting combinations of ECA and CBS at module level before adding them to the recommended bill of materials. (C) 2015 The Authors. Published by Elsevier Ltd.
引用
收藏
页码:175 / 184
页数:10
相关论文
共 11 条
  • [1] Beaucarne G, BACK CONT WORKSH 201
  • [2] Bennett IJ, P 29 EUPVSEC 2014
  • [3] Broek KM, P 27 EUPVSEC 2012
  • [4] Eerenstein W, P 25 EUPVSEC 2010, P3854
  • [5] GOVAERTS J, 2012, PHOTOVOLTAICS INT, P116
  • [6] Guillevin N, 29 EUPVSEC 2014
  • [7] 17.9% Metal-wrap-through mc-Si cells resulting in module efficiency of 17.0%
    Lamers, M. W. P. E.
    Tjengdrawira, C.
    Koppes, M.
    Bennett, I. J.
    Bende, E. E.
    Visser, T. P.
    Kossen, E.
    Brockholz, B.
    Mewe, A. A.
    Romijn, I. G.
    Sauar, E.
    Carnel, L.
    Julsrud, S.
    Naas, T.
    de Jong, P. C.
    Weeber, A. W.
    [J]. PROGRESS IN PHOTOVOLTAICS, 2012, 20 (01): : 62 - 73
  • [8] Lin Hongfeng, 2014, PHOTOVOLT INT, V23
  • [9] Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
    Nishikawa, Hiroshi
    Mikami, Saya
    Miyake, Koichi
    Aoki, Akira
    Takemoto, Tadashi
    [J]. MATERIALS TRANSACTIONS, 2010, 51 (10) : 1785 - 1789
  • [10] Spath M, P 23 EUPVSEC 2008, P2917