Studies on optimum distribution of fins in heat sinks filled with phase change materials

被引：85

作者：

Saha, S. K. ^{[1
]}

Srinivasan, K. ^{[1
]}

Dutta, P. ^{[1
]}

机构：

[1] Indian Inst Sci, Dept Mech Engn, Bangalore 560012, Karnataka, India

来源：

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 2008年 / 130卷 / 03期

关键词：

heat sink; phase change material; thermal conductivity enhancer;

D O I：

10.1115/1.2804948

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42 X 42 mm(2) base with a TCE height of 25 mm. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric firactions of TCE in the conglomerate of PCM and TCE are considered The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.

引用

页数：4

共 7 条

[1]

Abhat A., 1981, ISPRA COURSE ENERGY, P33

[2]

ALAWADHI EM, 2002, 8 INT C THERM THERM

[3] Application of phase change materials in thermal management of electronics [J].