ICPA for highly integrated concurrent dual-band wireless receivers

被引：13
|
作者：
Zhang, CC [1 ]
Liu, JJ [1 ]
Zhang, YP [1 ]
机构：
[1] Nanyang Technol Univ, Sch EEE, Integrated Syst Res Lab, Singapore, Singapore
来源：
ELECTRONICS LETTERS | 2003年 / 39卷 / 12期
关键词：
D O I：
10.1049/el:20030582
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A single-feed dual-band integrated circuit package antenna (ICPA) is reported. The ICPA, intended for use in either single-chip or single-package highly integrated concurrent dual-band wireless receivers, is implemented in the format of a cavity-down ceramic ball grid array package of 15 x 15 x 1.9 mm(3). Results show that the ICPA achieved a frequency ratio of 2.2, return loss bandwidth of 1.67% and gain of -8 dBi at 2.4 GHz, and return loss bandwidth of 0.69% and gain of -2 dBi at 5.25 GHz.
引用
收藏
页码：887 / 889
页数：3
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