Analysis and Modifying of Injection-Mold for Notebook Computer Housing by CAE

被引：0

作者：

Liu, B. ^{[1
]}

Liu, X. J. ^{[1
]}

Liao, L. ^{[1
]}

Du, Y. B. ^{[1
]}

机构：

[1] Shenzhen Inst Informat Technol, Shenzhen 518029, Peoples R China

来源：

FUNCTIONAL MANUFACTURING TECHNOLOGIES AND CEEUSRO I | 2010年 / 426-427卷

关键词：

CAE; injection molding; notebook computer housing;

D O I：

10.4028/www.scientific.net/KEM.426-427.568

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In the paper, C-Mold software was applied to the analysis of injecting molding of the notebook computer housing so as to solve the main problems of warpage and injection unbalance of the product. According to the results of filling analysis, the problem has been found out and the mold design has been improved. The described case showed the capability of CAE to find the reasons that cause warpage, duration of cooling period, sink mark, blush, color variation and shrinkage directly or indirectly. Thus, CAE analysis has a wide application prospects in injection molding.

引用

页码：568 / 571

页数：4

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