Using nanoindentation to investigate the temperature cycling of Sn-37Pb solders

被引:3
作者
Wen, Hua-Chiang [1 ]
Chou, Wu-Ching [1 ]
Lin, Po-Chen [2 ]
Jeng, Yeau-Ren [3 ]
Chen, Chien-Chang [4 ]
Chen, Hung-Ming [5 ]
Jiang, Don Son [6 ]
Cheng, Chun-Hu [7 ]
机构
[1] Natl Chiao Tung Univ, Dept Electrophys, Hsinchu 300, Taiwan
[2] Natl Chiao Tung Univ, Dept Mech Engn, Hsinchu 300, Taiwan
[3] Natl Chung Cheng Univ, Dept Mech Engn, Chiayi 621, Taiwan
[4] Natl Chiao Tung Univ, Res Grp Biomed Image Proc, Shing Tung Yau Ctr, Hsinchu 300, Taiwan
[5] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan
[6] Siliconware Precis Ind Co Ltd, Mat & Design Engn Div, Engn Ctr, Taichung 400, Taiwan
[7] Natl Taiwan Normal Univ, Dept Mechatron Engn, Taipei 106, Taiwan
关键词
Intermetallic compounds; Diffusion; Recrystallization; Electron microscopy; LOW-COST; RECRYSTALLIZATION; JOINTS; MICROSTRUCTURE; ALLOYS; INTERCONNECTIONS; MORPHOLOGY; EVOLUTION; STRESS;
D O I
10.1016/j.microrel.2017.05.004
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Using nanoindentation and energy dispersive X-ray spectrometry (EDS), we have conducted an investigation into corner failures to elucidate not only the nanomechanical properties of Sn-37Pb solder balls but also the effects of temperature cycling tests (TCTs). We found that the hardness of Sn-37Pb solder balls was greater in central locations [1.18 +/- 0.05 GPa for room-temperature (RT) sample; 1.3 +/- 0.05 GPa for TCT sample], but had standard values in corner locations (>0.2 +/- 0.02 GPa). The modulus increased after the TCTs. Nevertheless, the mechanical properties were closely related to the average area of the alpha-Pb phase. The average area of the Pb-rich region was more stable after the TCTs than that of the RT sample, due to the enhanced mechanical properties of the Sn-37Pb solder, suggesting good reliability. From an analysis of average areas in the RT sample, it appears that the Pb-rich solid solution that formed led to weak Sn-Pb bonds near the corner locations. Electron back scattered diffraction measurements revealed that grains with grain boundaries formed as a result of accelerated TCT cycling. We conclude that Sn-Pb recrystallization was initiated and propagated after the TCTs, followed by propagation to the interfacial region. (C) 2017 Published by Elsevier Ltd.
引用
收藏
页码:111 / 117
页数:7
相关论文
共 46 条
[41]   A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [J].
Yang, Chih-han ;
Zhou, Shiqi ;
Lin, Shih-kang ;
Nishikawa, Hiroshi .
MATERIALS, 2019, 12 (04)
[42]   Effect of initial microstructure, frequency and temperature on the low cycle fatigue behaviour of the soldering alloys 96.5Sn-3.5Ag and 63Sn-37Pb [J].
Boulaajaj, A. ;
Cabrera, J. M. ;
Prado, J. M. .
ENGINEERING FAILURE ANALYSIS, 2008, 15 (03) :220-228
[43]   Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders [J].
Lin, Jeng-Chi ;
Liang, Chien-Lung ;
Lin, Kwang-Lung .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 765
[44]   Reliability of Sn/Pb and Lead-free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185°C to+125°C) Space Missions [J].
Ramesham, Rajeshuni .
RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES X, 2011, 7928
[45]   Using a fiber Bragg grating technique to investigate temperature cycling strain of pressed TATB-based polymer-bonded explosives [J].
Xu, Yao ;
Gao, Siyue ;
Zhang, Jianzhong ;
Liu, Yanlei ;
Zhang, Weibin ;
Wang, Jun ;
Wang, Hui ;
Wang, Shujing ;
Ma, Zhiqiang ;
Chen, Pengwan ;
Liu, Rui .
PROPELLANTS EXPLOSIVES PYROTECHNICS, 2024, 49 (07)
[46]   Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier [J].
Kim, Seongjun ;
Kim, Keun-Soo ;
Kim, Sun-Sik ;
Suganuma, Katsuaki ;
Izuta, Goro .
JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) :2668-2675