Using nanoindentation to investigate the temperature cycling of Sn-37Pb solders

被引：3

作者：

Wen, Hua-Chiang ^{[1
]}

Chou, Wu-Ching ^{[1
]}

Lin, Po-Chen ^{[2
]}

Jeng, Yeau-Ren ^{[3
]}

Chen, Chien-Chang ^{[4
]}

Chen, Hung-Ming ^{[5
]}

Jiang, Don Son ^{[6
]}

Cheng, Chun-Hu ^{[7
]}

机构：

[1] Natl Chiao Tung Univ, Dept Electrophys, Hsinchu 300, Taiwan

[2] Natl Chiao Tung Univ, Dept Mech Engn, Hsinchu 300, Taiwan

[3] Natl Chung Cheng Univ, Dept Mech Engn, Chiayi 621, Taiwan

[4] Natl Chiao Tung Univ, Res Grp Biomed Image Proc, Shing Tung Yau Ctr, Hsinchu 300, Taiwan

[5] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan

[6] Siliconware Precis Ind Co Ltd, Mat & Design Engn Div, Engn Ctr, Taichung 400, Taiwan

[7] Natl Taiwan Normal Univ, Dept Mechatron Engn, Taipei 106, Taiwan

来源：

MICROELECTRONICS RELIABILITY | 2017年 / 78卷

关键词：

Intermetallic compounds; Diffusion; Recrystallization; Electron microscopy; LOW-COST; RECRYSTALLIZATION; JOINTS; MICROSTRUCTURE; ALLOYS; INTERCONNECTIONS; MORPHOLOGY; EVOLUTION; STRESS;

D O I：

10.1016/j.microrel.2017.05.004

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Using nanoindentation and energy dispersive X-ray spectrometry (EDS), we have conducted an investigation into corner failures to elucidate not only the nanomechanical properties of Sn-37Pb solder balls but also the effects of temperature cycling tests (TCTs). We found that the hardness of Sn-37Pb solder balls was greater in central locations [1.18 +/- 0.05 GPa for room-temperature (RT) sample; 1.3 +/- 0.05 GPa for TCT sample], but had standard values in corner locations (>0.2 +/- 0.02 GPa). The modulus increased after the TCTs. Nevertheless, the mechanical properties were closely related to the average area of the alpha-Pb phase. The average area of the Pb-rich region was more stable after the TCTs than that of the RT sample, due to the enhanced mechanical properties of the Sn-37Pb solder, suggesting good reliability. From an analysis of average areas in the RT sample, it appears that the Pb-rich solid solution that formed led to weak Sn-Pb bonds near the corner locations. Electron back scattered diffraction measurements revealed that grains with grain boundaries formed as a result of accelerated TCT cycling. We conclude that Sn-Pb recrystallization was initiated and propagated after the TCTs, followed by propagation to the interfacial region. (C) 2017 Published by Elsevier Ltd.

引用

页码：111 / 117

页数：7

共 47 条

[41] Study on Creep Damage in Sn60Pb40 and Sn3.8Ag0.7Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana [J].

Nyarko, Frank Kwabena Afriyie ;

Takyi, Gabriel ;

Effah, Francis Boafo .

CRYSTALS, 2021, 11 (04)

[42] A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [J].

Yang, Chih-han ;

Zhou, Shiqi ;

Lin, Shih-kang ;

Nishikawa, Hiroshi .

MATERIALS, 2019, 12 (04)

[43] Effect of initial microstructure, frequency and temperature on the low cycle fatigue behaviour of the soldering alloys 96.5Sn-3.5Ag and 63Sn-37Pb [J].

Boulaajaj, A. ;

Cabrera, J. M. ;

Prado, J. M. .

ENGINEERING FAILURE ANALYSIS, 2008, 15 (03) :220-228

[44] Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders [J].

Lin, Jeng-Chi ;

Liang, Chien-Lung ;

Lin, Kwang-Lung .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 765

[45] Reliability of Sn/Pb and Lead-free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185°C to+125°C) Space Missions [J].

Ramesham, Rajeshuni .

RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES X, 2011, 7928

[46] Using a fiber Bragg grating technique to investigate temperature cycling strain of pressed TATB-based polymer-bonded explosives [J].

Xu, Yao ;

Gao, Siyue ;

Zhang, Jianzhong ;

Liu, Yanlei ;

Zhang, Weibin ;

Wang, Jun ;

Wang, Hui ;

Wang, Shujing ;

Ma, Zhiqiang ;

Chen, Pengwan ;

Liu, Rui .

PROPELLANTS EXPLOSIVES PYROTECHNICS, 2024, 49 (07)

[47] Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier [J].

Kim, Seongjun ;

Kim, Keun-Soo ;

Kim, Sun-Sik ;

Suganuma, Katsuaki ;

Izuta, Goro .

JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) :2668-2675

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