Micro thermal management of high-power diode laser bars

被引：31

作者：

Lorenzen, D ^{[1
]}

Bonhaus, J

Fahrner, WR

Kaulfersch, E

Wörner, E

Koidl, P

Unger, K

Müller, D

Rölke, S

Schmidt, H

Grellmann, M

机构：

[1] Jenopt Laserdiode GmbH, D-07745 Jena, Germany

[2] Infineon Technol AG, D-40440 Dusseldorf, Germany

[3] Fern Univ Hagen, Dept Elect Devices, D-58084 Hagen, Germany

[4] Tech Univ Berlin, D-13355 Berlin, Germany

[5] Fraunhofer Inst Appl Solid State Phys, D-79108 Freiburg, Germany

[6] Tech Univ Chemnitz, D-09126 Chemnitz, Germany

[7] Roth & Rau Oberflachentech GmbH, D-09358 Wustenbrand, Germany

[8] Gerate & Pumpenbau Merbelsrod GmbH, D-98673 Merbelsrod, Germany

来源：

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS | 2001年 / 48卷 / 02期

关键词：

cooling; diamond; packaging; semiconductor lasers; temperature control; thermoelasticity; vapor deposition;

D O I：

10.1109/41.915407

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Lifetime and reliability of high-power diode laser bars are sensitively related to operating temperature, mounting stress, and solder electromigration. These three factors have been taken into account for the development of a new packaging technology for 1-cm laser bars of gallium arsenide. We examinae the use of chemical-vapor-deposited (CVD) diamond as heatspreaders in order to reduce thermal resistance of a microchannel cooler for Liquid cooling. We show that it is possible to perform hard soldering on a CVD-diamond with a new technique. Additionally, we present a controlled water cooling system fit to the now characteristics of the cooler. It permits one to adjust the emission wavelength of the diode lasers by changing the water flux.

引用

页码：286 / 297

页数：12

共 14 条

[1]

Baumann H, 1998, IEEE IND ELEC, P2336, DOI 10.1109/IECON.1998.724087

[2] Diamond heat spreaders for high power devices with integrated temperature sensors [J].

Bonhaus, J ;

Borchert, D ;

Denisenko, A ;

Fahrner, WR .

FOURTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 1998, :139-146

[3]

CHRISTON A, 1994, ELECTROMIGRATION ELE

[4]

DAIMINGER F, 1997, CLEO BALT MD

[5] Optimization of micro channel heat sinks for high power diode lasers in copper technology [J].

Ebert, T ;

Treusch, G ;

Loosen, P ;

Poprawe, R .

FABRICATION, TESTING, AND RELIABILITY OF SEMICONDUCTOR LASERS III, 1998, 3285 :25-29

[6]

Ehrlich W., 1994, Automatisierungstechnik, V42, P366

[7]

Funer M, 1998, APPL PHYS LETT, V72, P1149, DOI 10.1063/1.120997

[8]

KOIDL P, 1996, P 1 INT DIAM S SEOUL, V3, P3

[9]

LORENZEN D, 1997, P 2 MICR 97 BERL GER, P513

[10] DEMONSTRATION OF HIGH-PERFORMANCE SILICON MICROCHANNEL HEAT-EXCHANGERS FOR LASER DIODE-ARRAY COOLING [J].

MUNDINGER, D ;

BEACH, R ;

BENETT, W ;

SOLARZ, R ;

KRUPKE, W ;

STAVER, R ;

TUCKERMAN, D .

APPLIED PHYSICS LETTERS, 1988, 53 (12) :1030-1032

← 1 2 →