共 50 条
- [41] On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints Journal of Electronic Materials, 2011, 40 : 2081 - 2092
- [42] Damage accumulation and fracture in aged lead-free Sn-3.5Ag solder joints MONATSHEFTE FUR CHEMIE, 2012, 143 (09): : 1335 - 1339
- [43] Damage accumulation and fracture in aged lead-free Sn-3.5Ag solder joints Monatshefte für Chemie - Chemical Monthly, 2012, 143 : 1335 - 1339
- [46] A study on μBGA solder joints reliability using lead-free solder materials KSME INTERNATIONAL JOURNAL, 2002, 16 (07): : 919 - 926
- [47] A study on μBGA solder joints reliability using lead-free solder materials KSME International Journal, 2002, 16 : 919 - 926
- [50] RELIABILITY MODEL FOR ASSESSMENT OF LIFETIME OF LEAD-FREE SOLDER JOINTS EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,