The Theoretical Exploration of Fracture Mechanics for Lead-Free Solder Joints

被引:0
作者
Zheng, Sun [1 ]
机构
[1] Tianjin Maritime Coll, Tianjin, Peoples R China
来源
2010 INTERNATIONAL CONFERENCE ON MANAGEMENT SCIENCE AND ENGINEERING (MSE 2010), VOL 1 | 2010年
关键词
fracture mechanics; theoretical exploration; lead-free solder joints; RELIABILITY;
D O I
暂无
中图分类号
C93 [管理学]; O22 [运筹学];
学科分类号
070105 ; 12 ; 1201 ; 1202 ; 120202 ;
摘要
This paper discusses on the experimental and theoretical aspects of circular shear fatigue test, the test system, from the design will be applied to the solder joint reliability evaluation. The study found that test system must be carefully designed to avoid or reduce the error. Under special circumstances, the deformation of the chip mode must be suppressed in order to realize the precise control of shear displacement. No such consideration, circulation shear fatigue can produce misleading data and lost its advantage is a kind of effective method in the study, the fatigue performance and reliability of joints. The fact is, is found in solder fractures by shear mode by the crack-tip open mode, even load. This is because of the uneven joints of plastic deformation in the body. An application to the different shear test cycle alloy and treatment SAC305 exhibits that best fatigue resistance and Pb - Sn is the worst.
引用
收藏
页码:265 / 268
页数:4
相关论文
共 8 条
[1]   Rate Dependence of Bending Fatigue Failure Characteristics of Lead-Free Solder Joint [J].
Bang, Woong Ho ;
Chen, Liang-Shan ;
Kim, Choong-Un ;
Lee, Tae-Kyu ;
Liu, Kuo-Chuan .
2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, :2070-+
[2]   Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size [J].
Bang, Woong Ho ;
Kim, Choong-Un ;
Kang, Suk Hoon ;
Oh, Kyu Hwan .
JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (09) :1896-1905
[3]   Effect of simulation methodology on solder joint crack growth correlation [J].
Darveaux, R .
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, :1048-1058
[4]  
Dudek R, 2004, THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, P557
[5]  
Kim J.-M., 2010, TMS 2010 ANN M EXH S
[6]   Design for lead-free solder joint reliability of high-density packages [J].
Lau, J ;
Dauksher, W ;
Smetana, J ;
Horsley, R ;
Shangguan, D ;
Castello, T ;
Menis, I ;
Love, D ;
Sullivan, B .
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2004, 16 (01) :12-26
[7]   Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions [J].
Lau, JH .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (04) :728-735
[8]  
Leicht L, 2000, MICROELECTRON RELIAB, V40, P1129, DOI 10.1016/S0026-2714(00)00039-1