Rheological properties of particle-flux suspension paste

被引：4

作者：

Kim, JH ^{[1
]}

Satoh, M ^{[1
]}

Iwasaki, T ^{[1
]}

机构：

[1] Osaka Prefecture Univ, Grad Sch Engn, Dept Chem Engn, Sakai, Osaka 5998531, Japan

来源：

ADVANCED POWDER TECHNOLOGY | 2005年 / 16卷 / 01期

关键词：

rheology; viscosity; lead-free solder; solder paste; mechanical coating; dry process;

D O I：

10.1163/1568552053166629

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

In solder paste printing, one of the most important parameters is the viscosity of solder paste and solder powder load, and the physical characteristics of solder particles also affect the resulting viscosity. Therefore, the viscosity of solder paste with three kinds of solder particles (original, deformed and coated Sn-Zn-Bi alloy particles has been investigated by capillary rheometry. It is possible to predict reliable viscosity values for solder paste with deformed solder particles using the relation equation of viscosity and strain.

引用

页码：61 / 71

页数：11

共 16 条

[1] END CORRECTIONS IN THE CAPILLARY FLOW OF POLYETHYLENE [J].

BAGLEY, EB .

JOURNAL OF APPLIED PHYSICS, 1957, 28 (05) :624-627

[2] APPARENT SLIP-FLOW OF POLYMER-SOLUTIONS [J].

COHEN, Y ;

METZNER, AB .

JOURNAL OF RHEOLOGY, 1985, 29 (01) :67-102

[3] The influence of wall slip in the measurement of solder paste viscosity [J].

Ekere, NN ;

He, D ;

Cai, L .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (03) :468-473

[4] Lead-free solder flip chip-on-laminate assembly and reliability [J].

Hou, ZW ;

Tian, GY ;

Hatcher, C ;

Johnson, RW ;

Yaeger, EK ;

Konarski, MM ;

Crane, L .

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2001, 24 (04) :282-292

[5] APPARENT WALL SLIP VELOCITY COEFFICIENTS IN CONCENTRATED SUSPENSIONS OF NONCOLLOIDAL PARTICLES [J].

JANA, SC ;

KAPOOR, B ;

ACRIVOS, A .

JOURNAL OF RHEOLOGY, 1995, 39 (06) :1123-1132

[6]

Kwag C, 1999, J POLYM SCI POL PHYS, V37, P2771, DOI 10.1002/(SICI)1099-0488(19991001)37:19<2771::AID-POLB6>3.0.CO

[7]

2-9

[8] Monitoring the effects of storage on the rheological properties of solder paste [J].

Nguty, TA ;

Ekere, NN .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2000, 11 (05) :433-437

[9] Modeling the effects of temperature on the rheology of solder pastes and flux system [J].

Nguty, TA ;

Ekere, NN .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2000, 11 (01) :39-43

[10] Understanding the process window for printing lead-free solder pastes [J].

Nguty, TA ;

Salam, B ;

Durairaj, R ;

Ekere, NN .

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2001, 24 (04) :249-254

← 1 2 →