An Evaluation of the Impact of an Example of Thermal Bridging in Buildings and a Design Alternative

被引:1
|
作者
Kleinfeld, Jack M. [1 ]
机构
[1] Kleinfeld Tech Serv Inc, Bronx, NY 10463 USA
来源
THERMOSENSE: THERMAL INFRARED APPLICATIONS XXXIV | 2012年 / 8354卷
关键词
building survey; thermal bridge; energy loss; finite element analysis; heat transfer analysis; infrared; thermography; imaging;
D O I
10.1117/12.923877
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Thermal Bridges act as short circuits for energy flow between conditioned interior space and the outside environment. They readily show up in infrared imaging under appropriate conditions. An example of a thermal bridge in a standard building detail and an alternate design are analyzed to predict the energy impact of the bridge and of removing it. The analysis also provides guidance on whether infrared imaging can detect the thermal bridge.
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页数:35
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