CAVET on Bulk GaN Substrates Achieved With MBE-Regrown AlGaN/GaN Layers to Suppress Dispersion

被引:147
作者
Chowdhury, Srabanti [1 ]
Wong, Man Hoi [1 ]
Swenson, Brian L. [1 ]
Mishra, Umesh K. [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
关键词
AlGaN/GaN; current-aperture vertical electron transistor (CAVET); Mg-implanted; plasma-MBE; FIELD-EFFECT TRANSISTORS; HEMTS; ENHANCEMENT; VOLTAGE; MG;
D O I
10.1109/LED.2011.2173456
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A current aperture vertical electron transistor (CAVET) with a Mg-ion-implanted current blocking layer (CBL) and a channel regrown by plasma assisted molecular beam epitaxy (MBE), is successfully demonstrated on bulk GaN to work as a high voltage device. The fabrication of the device combined a drift region grown by metalorganic chemical vapor deposition (MOCVD), to hold the blocking voltage, with AlGaN/GaN layers regrown by plasma-MBE to conduct current. The device registered a maximum current of 4 kA.cm(-2) under direct-current operation offering a specific ON-state resistance R-on - A of 2.2 m Omega . cm(2). With 80 mu s pulses applied to the gate, the devices showed no dispersion. The increased aperture length Lap resulted in the decrease in specific R-on, as expected. The impact of the gate overlap to aperture L-go on the leakage current was studied, where the leakage current was found to increase with a smaller overlap.
引用
收藏
页码:41 / 43
页数:3
相关论文
共 13 条
[1]   SEMICONDUCTORS FOR HIGH-VOLTAGE, VERTICAL CHANNEL FIELD-EFFECT TRANSISTORS [J].
BALIGA, BJ .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (03) :1759-1764
[2]   AlGaN/GaN current aperture vertical electron transistors with regrown channels [J].
Ben-Yaacov, I ;
Seck, YK ;
Mishra, UK ;
DenBaars, SP .
JOURNAL OF APPLIED PHYSICS, 2004, 95 (04) :2073-2078
[3]   Enhancement and depletion mode AlGaN/GaN CAVET with Mg-ion-implanted GaN as current blocking layer [J].
Chowdhury, Srabanti ;
Swenson, Brian L. ;
Mishra, Umesh K. .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (06) :543-545
[4]   Use of Sub-nanometer Thick AlN to Arrest Diffusion of Ion-Implanted Mg into Regrown AlGaN/GaN Layers [J].
Chowdhury, Srabanti ;
Swenson, Brian L. ;
Lu, Jing ;
Mishra, Umesh K. .
JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (10)
[5]   1200-V Normally Off GaN-on-Si Field-Effect Transistors With Low Dynamic ON-Resistance [J].
Chu, Rongming ;
Corrion, Andrea ;
Chen, Mary ;
Li, Ray ;
Wong, Danny ;
Zehnder, Daniel ;
Hughes, Brian ;
Boutros, Karim .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (05) :632-634
[6]   High breakdown voltage achieved on AlGaN/GaN HEMTs with integrated slant field plates [J].
Dora, Y. ;
Chakraborty, A. ;
McCarthy, L. ;
Keller, S. ;
DenBaars, S. P. ;
Mishra, U. K. .
IEEE ELECTRON DEVICE LETTERS, 2006, 27 (09) :713-715
[7]   Carbon doping of GaN with CBr4 in radio-frequency plasma-assisted molecular beam epitaxy [J].
Green, DS ;
Mishra, UK ;
Speck, JS .
JOURNAL OF APPLIED PHYSICS, 2004, 95 (12) :8456-8462
[8]   New unipolar switching power device figures of merit [J].
Huang, AQ .
IEEE ELECTRON DEVICE LETTERS, 2004, 25 (05) :298-301
[9]   A vertical insulated gate AlGaN/GaN heterojunction field-effect transistor [J].
Kanechika, Masakazu ;
Sugimoto, Masahiro ;
Soejima, Narumasa ;
Ueda, Hiroyuki ;
Ishiguro, Osamu ;
Kodama, Masahito ;
Hnyashi, Eiko ;
Itoh, Kenji ;
Uesugi, Tsutomu ;
Kachi, Tetsu .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2007, 46 (20-24) :L503-L505
[10]   High Breakdown (> 1500 V) AlGaN/GaN HEMTs by Substrate-Transfer Technology [J].
Lu, Bin ;
Palacios, Tomas .
IEEE ELECTRON DEVICE LETTERS, 2010, 31 (09) :951-953