Low temperature synthesis of graphite on Ni films using inductively coupled plasma enhanced CVD

被引:39
作者
Cheng, Lanxia [1 ]
Yun, Kayoung [2 ]
Lucero, Antonio [1 ]
Huang, Jie [3 ]
Meng, Xin [1 ]
Lian, Guoda [1 ]
Nam, Ho-Seok [2 ]
Wallace, Robert M. [1 ]
Kim, Moon [1 ]
Venugopal, Archana [3 ]
Colombo, Luigi [3 ]
Kim, Jiyoung [1 ]
机构
[1] Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA
[2] Kookmin Univ, Sch Adv Mat Engn, Seoul, South Korea
[3] Texas Instruments Inc, Dallas, TX 75243 USA
关键词
FEW-LAYER GRAPHENE; RAMAN-SPECTROSCOPY; LARGE-AREA; SINGLE-CRYSTALLINE; PECVD GROWTH; HYDROGEN; DEPOSITION; CU; DISORDER; COPPER;
D O I
10.1039/c5tc00635j
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Controlled synthesis of graphite at low temperatures is a desirable process for a number of applications. Here, we present a study on the growth of thin graphite films on polycrystalline Ni films at low temperatures, about 380 degrees C, using inductively coupled plasma enhanced chemical vapor deposition. Raman analysis shows that the grown graphite films are of good quality as determined by a low I-D/I-G ratio, similar to 0.43, for thicknesses ranging from a few layers of graphene to several nanometer thick graphitic films. The growth of graphite films was also studied as a function of time, precursor gas pressure, hydrogen concentration, substrate temperature and plasma power. We found that graphitic films can be synthesized on polycrystalline thin Ni films on SiO2/Si substrates after only 10 seconds at a substrate temperature as low as 200 degrees C. The amount of hydrogen radicals, adjusted by changing the hydrogen to methane gas ratio and pressure, was found to dramatically affect the quality of graphite films due to their dual role as a catalyst and an etchant. We also find that a plasma power of about 50 W is preferred in order to minimize plasma induced graphite degradation.
引用
收藏
页码:5192 / 5198
页数:7
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