Compact distributed RLC interconnect models - Part III: Transients in single and coupled lines with capacitive load termination

被引：35

作者：

Venkatesan, R ^{[1
]}

Davis, JA ^{[1
]}

Meindl, JD ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 2003年 / 50卷 / 04期

关键词：

Bessel functions; crosstalk; inductance; interconnections; Laplace transforms; RLC circuits; time domain analysis; transmission line theory;

D O I：

10.1109/TED.2003.812507

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new, complete Physical model for the transient response of a high-speed global interconnect is rigorously derived. This. work improves an earlier model by including a capacitive load, termination to. a distributed resistance-inductance. capacitance (RLC) line, which more accurately models on-chip and off-chip high-speed global wires that drive large capacitive loads. in addition to key physical insight, the new transient expressions presented in this paper provide a quick and accurate estimation of interconnect time delay and crosstalk, which is necessary for rapid design space exploration for global wiring networks in future gigascale integration (GSI) systems.

引用

页码：1081 / 1093

页数：13

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