Preparation and sintering behavior of Au conductor pastes for LTCC substrate

被引：2

作者：

Wang, Y

Yang, L

Ma, JS

Dong, ZW

Yin, ML

机构：

[1] Tsing Hua Univ, Dept Mat Sci & Engn, Beijing 100084, Peoples R China

[2] E China Res Inst Microelect, Hefei 230022, Peoples R China

来源：

PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 | 2005年 / 475-479卷

关键词：

conductor paste; LTCC substrate; sintering; electronic packaging;

D O I：

10.4028/www.scientific.net/MSF.475-479.1763

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Fine Au powders with spherical morphology and good dispersivity were produced. The average particle size is 1 similar to 2m. The influences of constituents on the rheology of organic vehicles were investigated by orthogonal design method. Consequently, the compatible Au thick film pastes for LTCC substrate have been prepared. SEM was carried out to study the sintering behaviors and microstructures of the buried pastes with LTCC substrate. These pastes have high electrical conductivity (less than 3m/sq.), reliable wire bond strength (greater than 9 grams, 25m Au wire) and fine line printability (as small as 80m). The via filling technology was also discussed in this paper.

引用

页码：1763 / 1766

页数：4