Ceramic-metal interaction and wetting phenomena in the B4C/Cu system

被引:37
作者
Froumin, N [1 ]
Frage, N [1 ]
Aizenshtein, M [1 ]
Dariel, MP [1 ]
机构
[1] Ben Gurion Univ Negev, IL-84105 Beer Sheva, Israel
关键词
boron carbide; copper; interface; phase diagram; wetting;
D O I
10.1016/S0955-2219(03)00294-2
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The experimental study of the wetting phenomena in the boron carbide-copper system, using the sessile drop method at 1150 degreesC shows that molten Cu attacks boron carbide substrates forming a crater below the contact area. Boron additions prevent crater formation, improve wetting and, for a 10 at.% B alloy, reduce the equilibrium wetting angle to 40degrees. Thermodynamic analysis of the Cu-B-C system in the Cu-rich corner confirms the experimental results. These results and similar ones obtained in the TiC-Cu system suggest that the presence of a carbide phase over a concentration range is a key feature that governs wetting phenomena and chemical interaction at these metal-carbide interfaces. (C) 2003 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2821 / 2828
页数:8
相关论文
共 12 条
[1]  
Batalin G.I., 1985, IZVESTIYA VYSSHIKH U, V2, P125
[2]   Wetting of TiC by non-reactive liquid metals [J].
Frage, N ;
Froumin, N ;
Dariel, MP .
ACTA MATERIALIA, 2002, 50 (02) :237-245
[3]   Wettability and phase formation in the TiCx/Al system [J].
Frumin, N ;
Frage, N ;
Polak, M ;
Dariel, MP .
SCRIPTA MATERIALIA, 1997, 37 (08) :1263-1267
[4]  
Glushko V.P., 1981, HANDBOOK, V3
[5]   The wetting and spontaneous infiltration of ceramics by molten copper [J].
Kennedy, AR ;
Wood, JD ;
Weager, BM .
JOURNAL OF MATERIALS SCIENCE, 2000, 35 (12) :2909-2912
[6]   The effect of Ti and TiO2 additions on the pressureless sintering of B4C [J].
Levin, L ;
Frage, N ;
Dariel, MP .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1999, 30 (12) :3201-3210
[7]  
Massalski T. B., 1990, BINARY ALLOY PHASE D, V1
[8]  
Naidich YV, 1981, PROG SURF MEMBR SCI, P353, DOI DOI 10.1016/B978-0-12-571814-1.50011-7
[9]   CU-C AND AL-CU-C PHASE-DIAGRAMS AND THERMODYNAMIC PROPERTIES OF C IN THE ALLOYS FROM 1550-DEGREES-C TO 2300 DEGREES-C [J].
ODEN, LL ;
GOKCEN, NA .
METALLURGICAL TRANSACTIONS B-PROCESS METALLURGY, 1992, 23 (04) :453-458
[10]   The role of compound formation in reactive wetting: The Cu/SiC system [J].
Rado, C ;
Drevet, B ;
Eustathopoulos, N .
ACTA MATERIALIA, 2000, 48 (18-19) :4483-4491