Initial oxynitridation of a Si(001)-2x1 surface by NO

被引:0
作者
Miyata, N [1 ]
Watanabe, H [1 ]
Ichikawa, M [1 ]
机构
[1] Angstrom Technol Partnership, Joint Res Ctr Atom Technol, Tsukuba, Ibaraki 3050046, Japan
来源
STRUCTURE AND ELECTRONIC PROPERTIES OF ULTRATHIN DIELECTRIC FILMS ON SILICON AND RELATED STRUCTURES | 2000年 / 592卷
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have investigated the initial oxynitridation of an atomically flat Si(001)-2x1 surface by NO. We found that appropriate oxynitridation conditions, in which oxide decomposition does not occur, are required to suppress the roughness of the NO-reacted Si surface. Under these conditions, we investigated the growth behavior and chemical structure. The first oxynitridation, in which NO reacts with the first Si layer on the Si(001)-2x1 surface, takes place in a layer-by-layer manner caused by two-dimensional nucleation. However, further oxynitridation for the second Si layer proceeds in a three-dimensional manner in which the atomic-scale roughness at the oxynitride/Si interface increases. In addition, under our oxynitridation conditions, N is incorporated as Ni=Si-3, even though the oxynitride is ultrathin.
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页码:233 / 238
页数:6
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