Mechanical, thermal and dielectric behavior of hybrid filler polypropylene composites

In this study, thermal and dielectric behaviour of particle reinforced polymer composites are investigated experimentally. The main aim is to explore composite materials based on polymer matrix for microelectronics application. The continuous development of electronic devices requires optimum solutions for heat dissipation. This prompts the needs to the development of unique polymer composites that possess high thermal conductivity and low dielectric constant. In present work, hybrid composites were fabricated with micro-sized aluminum nitride and solid glass microspheres as filler material in polypropylene matrix in order to achieve the required property values. Experimental results are discussed in light and concluded that this new class of polymer composite can finds its potential application in future electronic packaging materials.