Cyanide-Free Silver Electrochemical Deposition on Copper and Nickel

被引：10
作者：
Christophe, J. [1 ]
Guilbert, G. [2 ]
Rayee, Q. [1 ]
Poelman, M. [2 ]
Olivier, M-G [2 ,3 ]
Buess-Herman, C. [1 ]
机构：
[1] Univ Libre Bruxelles, Fac Sci, Serv Chim Analyt & Chim Interfaces, B-1050 Brussels, Belgium
[2] Materia Nova, B-7000 Mons, Belgium
[3] Univ Mons, Mat Sci Dept, B-7000 Mons, Belgium
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2018年 / 165卷 / 14期
关键词：
DEEP EUTECTIC SOLVENTS; COMPLEXING AGENT; IONIC LIQUID; ELECTROLESS DEPOSITION; METALLIC SILVER; ELECTRODEPOSITION; URACIL; COATINGS; BEHAVIOR; BATH;
D O I：
10.1149/2.1011813jes
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Uracil was used as complexing agent to developp cyanide-free processes for silver deposition on copper and nickel substrates. We have highlighted that the molar ratio Ur/Ag+ between uracil and silver ions concentrations and the pH are crucial in the formulation of a stable and efficient bath and were found to be equal to 4 and 13.7 respectively. Silver was deposited in a single step on copper according to a three-dimensional nucleation mechanism while silver plating of nickel substrates was found to require an additionnal silver strike step. We worked out a choline chloride - oxalic acid DES-based silver solution which allowed to obtain bright, adherent and ductile silver coatings on Ni. (C) 2018 The Electrochemical Society.
引用
收藏
页码：D676 / D680
页数：5
相关论文
共 32 条
  • [1] Sustained electroless deposition of metallic silver from a choline chloride-based ionic liquid
    Abbott, Andrew P.
    Griffith, Jason
    Nandhra, Satvinder
    O'Connor, Cecil
    Postlethwaite, Stella
    Ryder, Karl S.
    Smith, Emma L.
    [J]. SURFACE & COATINGS TECHNOLOGY, 2008, 202 (10) : 2033 - 2039
  • [2] Electroless deposition of metallic silver from a choline chloride-based ionic liquid: a study using acoustic impedance spectroscopy, SEM and atomic force microscopy
    Abbott, Andrew P.
    Nandhra, Satvinder
    Postlethwaite, Stella
    Smith, Emma L.
    Ryder, Karl S.
    [J]. PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2007, 9 (28) : 3735 - 3743
  • [3] Ligand exchange in ionic systems and its effect on silver nucleation and growth
    Abbott, Andrew P.
    Azam, Muhammad
    Frisch, Gero
    Hartley, Jennifer
    Ryder, Karl S.
    Saleem, Saima
    [J]. PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2013, 15 (40) : 17314 - 17323
  • [4] The electrodeposition of silver composites using deep eutectic solvents
    Abbott, Andrew P.
    El Ttaib, Khalid
    Frisch, Gero
    Ryder, Karl S.
    Weston, David
    [J]. PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2012, 14 (07) : 2443 - 2449
  • [5] BLAIR A, 1995, MET FINISH, V93, P290
  • [6] Density, transport properties and electrochemical potential windows for the 2-hydroxy-N,N,N-trimethylethanaminium chlorides based ionic liquids at several temperatures
    Constantin, Virgil
    Adya, Ashok K.
    Popescu, Ana-Maria
    [J]. FLUID PHASE EQUILIBRIA, 2015, 395 : 58 - 66
  • [7] URACIL AND ITS INTERACTION WITH SILVER ION IN AQUEOUS ALKALINE MEDIA
    DEMEMBER, JR
    WALLACE, FA
    [J]. JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1975, 97 (21) : 6240 - 6245
  • [8] Uracil on Cu(110): A quantitative structure determination by energy-scanned photoelectron diffraction
    Duncan, D. A.
    Unterberger, W.
    Kreikemeyer-Lorenzo, D.
    Woodruff, D. P.
    [J]. JOURNAL OF CHEMICAL PHYSICS, 2011, 135 (01)
  • [9] Florea A, 2010, UNIV POLITEH BUCHAR, V72, P115
  • [10] Scaling of roughness in silver electrodeposition
    Foster, DG
    Shapir, Y
    Jorné, J
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (06) : C375 - C380
1234