Intelligent Packaging Systems: Sensors and Nanosensors to Monitor Food Quality and Safety

被引：91

作者：

Fuertes, Guillermo ^{[1
,2
]}

Soto, Ismael ^{[3
]}

Carrasco, Raul ^{[3
]}

Vargas, Manuel ^{[4
]}

Sabattin, Jorge ^{[1
,5
]}

Lagos, Carolina ^{[6
]}

机构：

[1] Univ Santiago Chile, Dept Ind Engn, Ave Ecuador 3769, Santiago, Chile

[2] Univ Cent Chile, Fac Ciencias Econ & Adm, Lord Cochrane 417, Santiago, Chile

[3] Univ Santiago Chile, Dept Elect Engn, Ave Ecuador 3519, Santiago, Chile

[4] Univ Andres Bello, Fac Ingn, Antonio Varas 880, Santiago, Chile

[5] Univ Bernardo OHiggins, Fac Ingn & Adm, Dept Matemat & Fis, Ave Viel 1497,Ruta 5 Sur, Santiago, Chile

[6] Univ Santiago Chile, Fac Management & Econ, Ave Libertador Bernardo OHiggins 3363, Santiago, Chile

来源：

JOURNAL OF SENSORS | 2016年 / 2016卷

关键词：

TIME-TEMPERATURE INDICATOR; TERAHERTZ BAND; CARBON-DIOXIDE; TTI; FREQUENCY; PRODUCTS; COMMUNICATION; TECHNOLOGIES; BIOSENSOR; FRESHNESS;

D O I：

10.1155/2016/4046061

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The application of nanotechnology in different areas of food packaging is an emerging field that will grow rapidly in the coming years. Advances in food safety have yielded promising results leading to the development of intelligent packaging (IP). By these containers, it is possible to monitor and provide information of the condition of food, packaging, or the environment. This article describes the role of the different concepts of intelligent packaging. It is possible that this new technology could reach enhancing food safety, improving pathogen detection time, and controlling the quality of food and packaging throughout the supply chain.

引用

页数：8

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