Development of structure and properties in bimetallic Al/Cu sandwich composite during cumulative severe plastic deformation

被引:33
作者
Kocich, Radim [1 ]
Kuncicka, Lenka [1 ]
机构
[1] VSB TU Ostrava, Fac Mat Sci & Technol, Dept Mat Forming, 17 Listopadu 15, Ostrava 70833, Czech Republic
关键词
Sandwich composite; twist channel angular pressing; TCAP; finite element method; grain refinement; residual stress; ANGULAR PRESSING TCAP; THERMAL-CONDUCTIVITY; HEAT-TREATMENT; STRENGTH; MICROSTRUCTURE; ALUMINUM; STRESS; STRAIN; SHEAR;
D O I
10.1177/1099636221993886
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Development of modern materials is non-negligibly connected with enhancement of their mechanical and utility properties, which can advantageously be performed via optimized deformation processing. The study presents preparation of Al/Cu sandwich composite, reinforced with Cu-wires, by the twist channel angular pressing (TCAP) method. Extrusion of the sandwich composite via single and double pass TCAP was simulated using the finite element method, and performed experimentally. The predicted deformation behaviour was verified by 3 D Micro-CT scanning, as well as detailed microstructure observations. The results showed that already the single TCAP resulted in substantial deformation strengthening of both the component metals, and the effective strain imposed within the Al-sheath reached the value of 5 after the second pass. The Al-sheath also featured homogeneous distribution of the lowest absolute values of residual stress, and the smallest average grain size of 1.66 mu m. The Cu grains within both the composites were also significantly refined, to almost 3 mu m after the second pass. Nevertheless, the observed parameters featured slight variations across the composites' cross-sections, which can be attributed to the plastic flow behaviour phenomena. The severe imposed shear strain also resulted in increase in microhardness and imparted changes in the thermal conductivity.
引用
收藏
页码:4252 / 4275
页数:24
相关论文
共 39 条
[1]  
[Anonymous], SOC IND APPL MATH, DOI 10.1137/1.9780898719277.ch3
[2]   Severe plastic deformation (SPD) processes for metals [J].
Azushima, A. ;
Kopp, R. ;
Korhonen, A. ;
Yang, D. Y. ;
Micari, F. ;
Lahoti, G. D. ;
Groche, P. ;
Yanagimoto, J. ;
Tsuji, N. ;
Rosochowski, A. ;
Yanagida, A. .
CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2008, 57 (02) :716-735
[3]   An overview on severe plastic deformation: research status, techniques classification, microstructure evolution, and applications [J].
Bagherpour, E. ;
Pardis, N. ;
Reihanian, M. ;
Ebrahimi, R. .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2019, 100 (5-8) :1647-1694
[4]  
Beausir B., 2017, ANAL TOOLS ELECT X R
[5]   Influence of interfacial structure development on the fracture mechanism and bond strength of aluminum/copper bimetal plate [J].
Chen, Chih-Yuan ;
Chen, Hao-Long ;
Hwang, Weng-Sing .
MATERIALS TRANSACTIONS, 2006, 47 (04) :1232-1239
[6]   An approach for fabrication of Al-Cu composite by high pressure torsion [J].
Danilenko, V. N. ;
Sergeev, S. N. ;
Baimova, J. A. ;
Korznikova, G. F. ;
Nazarov, K. S. ;
Khisamov, R. Kh ;
Glezer, A. M. ;
Mulyukov, R. R. .
MATERIALS LETTERS, 2019, 236 :51-55
[7]   A new method for producing bimetallic rods [J].
Eivani, A. R. ;
Taheri, A. Karimi .
MATERIALS LETTERS, 2007, 61 (19-20) :4110-4113
[8]   Numerical analyses of the thermal conductivity of random hollow sphere structures [J].
Fiedler, T. ;
Loeffler, R. ;
Bernthaler, T. ;
Winkler, R. ;
Belova, I. V. ;
Murch, G. E. ;
Oechsner, A. .
MATERIALS LETTERS, 2009, 63 (13-14) :1125-1127
[9]   Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening [J].
Huang, JY ;
Zhu, YT ;
Jiang, H ;
Lowe, TC .
ACTA MATERIALIA, 2001, 49 (09) :1497-1505
[10]   Mechanochemical joining in cold roll-cladding of tri-layered Cu/Al/Cu composite and the interface cracking behavior [J].
Kim, In-Kyu ;
Hong, Sun Ig .
MATERIALS & DESIGN, 2014, 57 :625-631