Homoepitaxial growth of GaN and AlGaN/GaN heterostructures by molecular beam epitaxy on freestanding HVPE gallium nitride for electronic device applications

被引:20
|
作者
Storm, DF
Katzer, DS
Mittereder, JA
Binari, SC
Shanabrook, BV
Xu, X
McVey, DS
Vaudo, RP
Brandes, GR
机构
[1] USN, Res Lab, Div Elect Sci & Technol, Washington, DC 20375 USA
[2] Cree Inc, Durham, NC 27703 USA
关键词
hydride vapor phase epitaxy; molecular beam epitaxy; nitrides; semiconducting gallium compounds; high electron mobility transistors;
D O I
10.1016/j.jcrysgro.2005.03.009
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
We discuss the growth and characterization of homoepitaxial GaN layers and AlGaN/GaN high electron mobility transistor (HEMT) structures grown by plasma-assisted molecular beam epitaxy (MBE) on freestanding n-GaN substrates. The GaN substrates were fabricated by hydride vapor phase epitaxy and exhibit low dislocation densities of similar to 10(7) cm(-2). The best MBE-grown homoepitaxial epilayers on these substrates were grown in the gallium droplet regime. Root-mean-square roughnesses of these layers were 3.5-4.0 angstrom over 5 x 5 mu m(2) regions. AlGaN/GaN HEMT structures were grown on these substrates and exhibit room-temperature Hall mobilities of 1920 cm(2)/V s at an electron sheet density of 0.9 x 10(13) cm(-2). Electrical isolation of the two-dimensional electron gas from the conductive substrate was accomplished using a Be:GaN buffer. HEMT devices were photolithographically defined and DC and RF device characteristics were measured. Off-state breakdown voltages of 90 V, saturated drain currents of nearly 700 mA/mm, and gate leakage currents of 0.07 mA/mm were observed on unpassivated devices. Preliminary results on RF performance and device reliability are presented and discussed. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:32 / 37
页数:6
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