Electrical Characterization of Al2O3/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatments

被引:25
作者
Trinh, H. D. [1 ]
Brammertz, G. [2 ]
Chang, E. Y. [1 ,3 ]
Kuo, C. I. [1 ]
Lu, C. Y. [1 ]
Lin, Y. C. [1 ]
Nguyen, H. Q. [1 ]
Wong, Y. Y. [1 ]
Tran, B. T. [1 ]
Kakushima, K. [4 ]
Iwai, H. [4 ]
机构
[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan
[2] Interuniv Microelect Ctr, B-3001 Louvain, Belgium
[3] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan
[4] Tokyo Inst Technol, Frontier Res Ctr, Kanagawa 2268502, Japan
关键词
Al2O3; atomic layer deposition (ALD); C-V simulation; InAs; metal-oxide-semiconductor capacitors (MOSCAPs); surface treatment;
D O I
10.1109/LED.2011.2128853
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ex situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al2O3/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.
引用
收藏
页码:752 / 754
页数:3
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