Effects of grain size and temperature on mechanical response of nanocrystalline copper

被引：36

作者：

Fang, Te-Hua ^{[1
]}

Huang, Chao-Chun ^{[1
]}

Chiang, Tsung-Cheng ^{[1
]}

机构：

[1] Natl Kaohsiung Univ Appl Sci, Dept Mech Engn, Kaohsiung 807, Taiwan

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2016年 / 671卷

关键词：

Nanocrystalline; Yield stress; Grain growth; Strain hardening; MOLECULAR-DYNAMICS; DEFORMATION; METALS; BOUNDARIES; CROSSOVER; GROWTH; MODEL;

D O I：

10.1016/j.msea.2016.06.042

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Molecular dynamics simulation is utilized to study the effects of grain size and temperature on the mechanical properties of quasi-two-dimensional (2D) nanocrystalline Cu with grain sizes of 3-8 nm under uniaxial tensile tests. Our results show that the grain growth is caused by the grain rotation and leads to strain hardening at 300 K for a grain size of < 5 nm and at 100 K for a grain size of <4 nm. For a grain size of <= 7 nm, the inverse Hall-Petch relation was observed in the yield stress. The Young's modulus for the quasi-2D system is higher than that for the three-dimensional (3D) system. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：1 / 6

页数：6

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