Effects of deposition method on the microstructure and intermetallic compound formation in Ag-Sn bilayers

被引：7

作者：

Rossi, P. ^{[1
]}

Zotov, N. ^{[1
]}

Mittemeijer, E. J. ^{[1
,2
]}

机构：

[1] Max Planck Inst Intelligent Syst, D-70569 Stuttgart, Germany

[2] Univ Stuttgart, Inst Mat Sci, D-70569 Stuttgart, Germany

来源：

SURFACE & COATINGS TECHNOLOGY | 2016年 / 295卷

关键词：

Evaporation; Magnetron sputtering; Ag-Sn bilayers; Surface energy; SILVER; GROWTH; TEMPERATURE; SURFACE; NANOPARTICLES; NUCLEATION; MECHANISM; SOLDER; FILMS;

D O I：

10.1016/j.surfcoat.2015.10.057

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Thermal evaporation and magnetron sputtering were used for the deposition of bilayers of Ag and Sn with different stacking sequences of the sublayers, Ag on Sn (Ag/Sn) or Sn on Ag (Sn/Ag). The deposition method used significantly affects the intermetallic compound (IMC) formation in these thin films already during film deposition. Comparison of the corresponding microstructures and textures indicates that the observed, striking differences in IMC formation for the case of Ag/Sn bilayers can be related to the interplay of Sn upward diffusion, surface energy and interfacial intermixing for the two deposition methods. (C) 2015 Elsevier B.V. All rights reserved.

引用

页码：88 / 92

页数：5