A 130-nm 0.9-V 66-MHz 8-Mb (256K x 32) local SONOS embedded flash EEPROM

被引:20
作者
Seo, MK [1 ]
Sim, SH [1 ]
Oh, MH [1 ]
Lee, HS [1 ]
Kim, SW [1 ]
Cho, IW [1 ]
Kim, GH [1 ]
Kim, MG [1 ]
机构
[1] Samsung Elect Co Ltd, CORE Dev Team, Syst LSI Div, Yongin, Gyunggi Do, South Korea
关键词
EEPROM; embedded flash memory; flash memory; high frequency; low operating current; program disturbance;
D O I
10.1109/JSSC.2005.845564
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In a 0.13-mu m CMOS logic compatible process, a 256K x 32 bit (8 Mb) local SONOS embedded flash EEPROM was implemented using the ATD-assisted current sense amplifier (AACSA) for 0.9 V (0.7 similar to 1.4 V) low V-CC application. Read operation is performed at a high frequency of 66 MHz and shows a low current of typically 5 mA at 66-MHz; operating frequency. Program operation is performed for common source array with wide I/Os (x 32) by using the data-dependent source bias control scheme (DDSBCS). This novel local SONOS embedded flash EEPROM core has the cell size of 0.276 mu m(2) (16.3 F-2 /bit) and the program and erase time of 20 mu s and 20 ms, respectively.
引用
收藏
页码:877 / 883
页数:7
相关论文
共 9 条
[1]  
Cho IW, 2004, 2004 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, P240
[2]  
DENNIS A, 2001, P AER C, V5, P2295
[3]   A 1.4V 60MHz access, 0.25μm embedded flash EEPROM [J].
Kataoka, T ;
Fuchigami, I ;
Nishida, Y ;
Kimura, T ;
Aruga, R ;
Okuda, Y ;
Michiyama, J .
PROCEEDINGS OF THE IEEE 1999 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 1999, :243-246
[4]  
KIM JH, 2003, S VLSI TECHN, P31
[5]   A 512-KB FLASH EEPROM EMBEDDED IN A 32-B MICROCONTROLLER [J].
KUO, C ;
WEIDNER, M ;
TOMS, T ;
CHOE, H ;
CHANG, KM ;
HARWOOD, A ;
JELEMENSKY, J ;
SMITH, P .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1992, 27 (04) :574-582
[6]  
Lee YK, 2002, 2002 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, P208, DOI 10.1109/VLSIT.2002.1015455
[7]  
TSAI WJ, 2001, IEDM, P719
[8]   A low voltage SONOS nonvolatile semiconductor memory technology [J].
White, MH ;
Yang, YL ;
Purwar, A ;
French, ML .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (02) :190-195
[9]   On the go with SONOS [J].
White, MH ;
Adams, DA ;
Bu, JK .
IEEE CIRCUITS & DEVICES, 2000, 16 (04) :22-31