Polarity Control of an All-Sputtered Epitaxial GaN/AlN/Al Film on a Si(111) Substrate by Intermediate Oxidization

被引:4
作者
Nagata, Takahiro [4 ,5 ]
Suemoto, Yuya [1 ]
Ueoka, Yoshihiro [1 ]
Mesuda, Masami [1 ]
Sang, Liwen [2 ]
Chikyow, Toyohiro [3 ]
机构
[1] Tosoh Corp, Ayase, Kanagawa 2521123, Japan
[2] NIMS Int Ctr Mat Nanoarchitecton WPFMANA, Tsukuba, Ibaraki 3050044, Japan
[3] NIMS, Res & Serv Div Mat Data & Integrated Syst MaDIS, Tsukuba, Ibaraki 3050044, Japan
[4] Natl Inst Mat Sci NIMS, Res Ctr Funct Mat RCFM, Tsukuba, Ibaraki 3050044, Japan
[5] NIMS, Int Ctr Mat Nanoarchitecton WPFMANA, Tsukuba, Ibaraki 3050044, Japan
来源
ACS OMEGA | 2022年 / 7卷 / 23期
关键词
B-ION IMPLANTS; SI SUBSTRATE; GAN FILMS; SURFACE; GROWTH; SPECTROSCOPY; SCATTERING; AIN;
D O I
10.1021/acsomega.2c00957
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The ability to control the polarity of an all-sputtered epitaxial GaN/AlN/Al film on a Si(111) substrate via intermediate oxidization was investigated. A stable surface of GaN on a Si substrate is a N-terminated surface (-c surface); hence, for electric device applications, the Ga-terminated surface (+c surface) is preferable. The GaN/AlN/Al film on Si(111) showed a -c surface, as confirmed by time-of-flight lowenergy atom scattering spectroscopy (TOFLAS) and X-ray photoelectron spectroscopy (XPS). The AlN layer was intentionally oxidized via air exposure during film growth. The GaN surface subjected to the oxidization process had the +c surface. Secondary-ion mass spectrometry measurements indicated a high oxygen concentration after the intentional oxidization. However, the intentional oxidization degraded the crystallinity of the GaN/AlN layer. By changing the oxidization point and repeating the GaN/AlN growth, the crystallinity of GaN was recovered. Such polarity control of GaN on Si grown by sputtering shows strong potential for the fabrication of largediameter +c-GaN template substrates at low cost.
引用
收藏
页码:19380 / 19387
页数:8
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