Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

被引:15
作者
Cao, LQ [1 ]
Lai, ZH
Liu, JH
机构
[1] Chalmers Univ Technol, Sch Mech Engn, Swedish Microsyst Integrat Technol Ctr, SE-43153 Molndal, Sweden
[2] Chalmers Univ Technol, Sch Mech Engn, Div Elect Prod, SE-43153 Molndal, Sweden
关键词
anisotropic conductive adhesive (ACA); moisture gffect; and peel strength;
D O I
10.1115/1.1846066
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and fine pitch capability are the major advantages of conducting adhesive technology. A new and innovative connection technology geared towards achieving increased functionality at a lower total system cost is anisotropic conductive adhesive (ACA) interconnection. ACAs, when used for flip chip assembly, provide electrical as well as mechanical interconnections for fine pitch applications. This work deals with adhesion issues between ACA on polyimide materials. The paper presents a reliability assessment of adhesive joints using ACA on polyimide substrate that was conducted by testing samples at various aging temperature, high humidity and high pressure enviromments. The effects of high temperature and high humidity on the bond strength of ACA joints were measured using 90 deg peel test as well as by microstructural examination. It was found that aging generally caused a decrease in peel strength, especially the results of scanning electronic microscopy showed that the pressure cooker test could most effectively reveal the adhesion behavior.
引用
收藏
页码:43 / 46
页数:4
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