Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint

被引：0

作者：

Zhu, Ze ^{[1
]}

Chan, Yan-cheong ^{[1
]}

Wu, Fengshun ^{[2
]}

机构：

[1] City Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China

[2] Huazhong Univ Sci & Technol, Inst Mat & Sci, Wuhan, Peoples R China

来源：

2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2015年

关键词：

lead-free; ZrO2; nanoparticles; shear strength; intermetallic compound; INTERMETALLIC COMPOUNDS; CU SUBSTRATE;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Lead-free solder has been used to replace toxic lead-containing solder. Sn(42)Bis(58) solder has attracted a lot of attention for its low-cost, low melting temperature. Nanoparticles, such as metallic, nonmetallic and oxidant, have been doped into solders to improve their performance. In this study, we investigated the effect of ZrO2 nanoparticles on the mechanical properties of Sn(42)Bis(58) solder joints. Firstly, solder balls were made from solder paste by stencil printing and reflow. Next, solder balls were reflowed to form solder joints on Cu pad metalized with Au/Ni layers. Then, solder joints were put into an isothermal aging oven for different aging time. Shear tests were performed to investigate the shear strength of both solder joints subjected to aging time. Scanning electron microscope (SEM) was employed to study microstructure evolution in solder matrix. The results showed that the shear strength of Sn(42)Bis(58) solder joints was reinforced with the incorporation of ZrO2 nanoparticles. The growth of intermetallic compounds (IMCs) in ZrO2 doped solder joints was observed to be impeded.

引用

页数：4

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