Fatigue and thermal fatigue damage analysis of thin metal films

被引:64
作者
Zhang, G. P.
Volkert, C. A.
Schwaiger, R.
Moenig, R.
Kraft, O.
机构
[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
[2] Forschungszentrum Karlsruhe, Inst Mat Forschung 2, D-76021 Karlsruhe, Germany
关键词
D O I
10.1016/j.microrel.2007.04.005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we summarize several testing methods that are currently available for the characterization of fatigue properties of thin metal films. Using these testing methods, a number of experimental investigations of the fatigue and thermal fatigue of metal films with thicknesses ranging from micrometers to sub-micrometers are described. Extensive experimental observations as well as theoretical analyses reveal that the damage behavior, i.e. typical fatigue extrusions and cracking, are quite different from that of bulk materials, and are controlled by the length scales of the materials. Due to the high surface to volume ratio of thin films interface-induced and diffusion-related damage are prevalent in these small length scale materials. As a result, interfaces pose a serious threat to the reliability of thin films. (c) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2007 / 2013
页数:7
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