Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

被引:65
作者
Bosco, Nick [1 ]
Silverman, Timothy J. [1 ]
Kurtz, Sarah [1 ]
机构
[1] Natl Renewable Energy Lab, 15013 Denver West Pkwy, Golden, CO 80401 USA
关键词
Photovoltaic reliability; Solder fatigue; Acceleration factor; Thermal cycling; RELIABILITY;
D O I
10.1016/j.microrel.2016.03.024
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure. Published by Elsevier Ltd.
引用
收藏
页码:124 / 129
页数:6
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