A novel benzocyclobutene-based device for studying the dynamics of heat transfer during the nucleation process

被引:18
作者
Moghaddam, Saeed [1 ,2 ]
Kiger, Kenneth T. [2 ]
Modafe, Afireza [2 ]
Ghodssi, Reza [3 ,4 ]
机构
[1] Adv Thermal & Environm Concepts Inc, College Pk, MD 20740 USA
[2] Univ Maryland, Dept Mech Engn, MEMS Sensors & Actuators Lab, College Pk, MD 20742 USA
[3] Univ Maryland, Dept Elect & Comp Engn,Energy Res Ctr, MEMS Sensors & Actuators Lab, Syst Res Inst,Fischell Dept Bioengn, College Pk, MD 20742 USA
[4] Univ Maryland, Dept Mat Sci & Engn, College Pk, MD 20742 USA
关键词
boiling; bubble; heat transfer;
D O I
10.1109/JMEMS.2007.907781
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel microelectromechanical device has been developed to study the details of the heat transfer mechanisms involved at the nucleation site for the nucleate boiling process. This device enables quantifying the magnitude, time period of activation, and specific areas of influence of different mechanisms of heat transfer from the surface with a resolution several times greater than previously reported. This is achieved through the use of an array of embedded temperature sensors within a carefully designed dual-layer (silicon and benzocyclobutene) wall which allows for the accurate calculation of local heat flux, circumventing difficulties encountered when using existing methods. The sensors are radially distributed around the nucleation site. Heat is supplied to the wall by a thin film heater fabricated on the outer nonwetted surface. Single bubbles are generated at the center of the array while the temperatures and the bubble images are recorded with a sampling frequency of 8 kHz. The temperature data provided the necessary thermal boundary conditions to numerically calculate the surface heat flux with an unprecedented radial resolution of 22-40 mu m. Fabrication, characterization, and the ability of the developed device to elucidate the heat transfer aspects of the nucleation process are demonstrated.
引用
收藏
页码:1355 / 1366
页数:12
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