Surface characterization of self-assembled N-Cu nanostructures

被引：2
作者：
Cristina, Lucila J. [1 ]
Moreno-Lopez, Juan C. [1 ]
Sferco, Silvano J. [1 ,2 ]
Passeggi, Mario C. G., Jr. [1 ]
Vidal, Ricardo A. [1 ]
Ferron, Julio [1 ,3 ]
机构：
[1] Inst Desarrollo Tecnol Ind Quim CONICET UNL, Lab Superficies & Interfaces, RA-3450 Guemes, Santa Fe, Argentina
[2] Univ Nacl Litoral, Fac Bioquim & Ciencias Biol, Dept Fis, RA-2829 Santiago Del Estero, Santa Fe, Argentina
[3] Univ Nacl Litoral, Fac Ingn Quim, Dept Mat, RA-2829 Santiago Del Estero, Santa Fe, Argentina
来源：
APPLIED SURFACE SCIENCE | 2012年 / 258卷 / 06期
关键词：
Copper nitride; Nanostructures; Self-assembling; LEIS; STM; Surface spectroscopy; NITRIDE THIN-FILMS; NITROGEN ADSORPTION; COPPER; GROWTH; ARRAYS; SCATTERING; CU(100); DOT;
D O I：
10.1016/j.apsusc.2011.04.105
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
We report on the process of low energy N-2(+) implantation and annealing of a Cu(0 0 1) surface. Through AES we study the N diffusion process as a function of the substrate temperature. With STM and LEIS we characterize the surface morphology and the electronic structure is analyzed with ARUPS. Under annealing (500 < T < 700 K) N migrates to the surface and reacts forming a CuxN compound that decomposes at temperatures above 700 K. LEIS measurements show that N locates on the four-fold hollow sites of the Cu(0 0 1) surface in a c(2 x 2) arrangement. Finally, a gap along the [0 0 1] azimuthal direction is determined by ARUPS. DFT calculations provide support to our conclusions. (C) 2011 Elsevier B. V. All rights reserved.
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页码：2047 / 2051
页数：5
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