TEM Interfacial Characteristics of Thermosonic Gold Wire Bonding on Aluminium Metallization

被引：1

作者：

Xu, H. ^{[1
]}

Liu, C. ^{[1
]}

Silberschmidt, V. V. ^{[1
]}

Chen, Z. ^{[2
]}

Sivakumar, M. ^{[3
]}

机构：

[1] Univ Loughborough, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

[3] ASM Technol Singapore, Singapore 768924, Singapore

来源：

2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009) | 2009年

关键词：

D O I：

10.1109/EPTC.2009.5416495

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A native alumina thin film existing on aluminium and its evolution in thermosonic gold wire bonding were characterized using high resolution transmission electron microscopy (HR TEM). It has been found that the partly fracture of this alumina film by the ultrasonic vibration allows the interdiffusion at the Au/Al interface, such that the intermetallic compounds (IMCs) are formed. The IMCs are identified as Au4Al and AuAl2 with a thickness of approximately 300 nm. With a higher ultrasonic energy, IMCs are formed in more contact areas, resulting in a stronger bond. Based on these experimental results, a mechanism of ultrasonic gold wire bonding is proposed, which helps to understand the correlation among ultrasonic energy, interfacial structure and bonding strength.

引用

页码：512 / +

页数：3

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