Miniature vapor compression refrigeration system for electronics cooling

被引:26
作者
Poachaiyapoom, Akasit [1 ]
Leardkun, Rattapon [1 ]
Mounkong, Jirawat [1 ]
Wongwises, Somchai [1 ,2 ]
机构
[1] King Mongkuts Univ Technol Thonburi, Fluid Mech Thermal Engn & Multiphase Flow Res Lab, FUTURE, Dept Mech Engn,Fac Engn, Bangkok 10140, Thailand
[2] Royal Soc Thailand, Acad Sci, Bangkok 10300, Thailand
关键词
Micro-channel; Vapor compression system; Heat sink; Electronics cooling; PERFORMANCE;
D O I
10.1016/j.csite.2018.100365
中图分类号
O414.1 [热力学];
学科分类号
摘要
A miniature vapor compression refrigeration system using R134a is investigated for electronics cooling. The system consists of four main components: an evaporator, a compressor, a capillary tube, and a condenser. The evaporator is a micro-channel heat sink with 106 rectangular cross-sectional channels. Each micro-channel has a depth of 450 mu m, a width of 150 mu m, a wall thickness of 150 mu m, and a length of 20 mm. Experimental conditions include compressor speeds ranging between 3000 and 6000 RPM and heating power of 100 W, 150 W, and 200 W. The experimental results show that increased compressor speed could reduce the surface temperature of the heater but also decrease the coefficient of performance (COP). The highest COP gained is 9.069 at a compressor speed of 3000 RPM and a heating power of 200 W, which yields the heater surface temperature of 73.3 degrees C. This miniature vapor compression refrigeration system could be used for electronics cooling with the most suitable conditions at heating power of 200 W and compressor speed of 3000 RPM. The proposed system is not suitable for electronics cooling at a heating power of 100 W and 150 W, because the heater surface temperature is less than 40 degrees C.
引用
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页数:7
相关论文
共 12 条
  • [1] [Anonymous], **NON-TRADITIONAL**
  • [2] Vapor compression refrigeration cycle for electronics cooling - Part I: Dynamic modeling and experimental validation
    Catano, Juan
    Zhang, Tiejun
    Wen, John T.
    Jensen, Michael K.
    Peles, Yoav
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2013, 66 : 911 - 921
  • [3] Two-phase flow model of refrigerants flowing through helically coiled capillary tubes
    Chingulpitak, Sukkarin
    Wongwises, Somchai
    [J]. APPLIED THERMAL ENGINEERING, 2010, 30 (14-15) : 1927 - 1936
  • [4] Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application
    Ghasemi, Seyed Ebrahim
    Ranjbar, A. A.
    Hosseini, M. J.
    [J]. MICROELECTRONICS RELIABILITY, 2017, 73 : 97 - 105
  • [5] Experimental study of a miniature vapor compression refrigeration system with two heat sink evaporators connected in series or in parallel
    He, Jing
    Wu, Yuting
    Chen, Xia
    Lu, Yuanwei
    Ma, Chongfang
    Du, Chunxu
    Liu, Gang
    Ma, Rui
    [J]. INTERNATIONAL JOURNAL OF REFRIGERATION-REVUE INTERNATIONALE DU FROID, 2015, 49 : 28 - 35
  • [6] Jayaram B. N., 2015, NOVEL DESIGN PETITE, DOI [10.13140/2.1.3920.1606, DOI 10.13140/2.1.3920.1606]
  • [7] Performance evaluation of a hybrid cooling system for electronic chips
    Jeng, Lung-Yue
    Teng, Tun-Ping
    [J]. EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2013, 45 : 155 - 162
  • [8] Application of refrigeration system in electronics cooling
    Nnanna, AGA
    [J]. APPLIED THERMAL ENGINEERING, 2006, 26 (01) : 18 - 27
  • [9] Sathe A.A., 2008, P INT COMPRESSOR ENG, P1115
  • [10] Trutassanawin S., 2004, INT REFR AIR COND C, P678