A Low-Cost and High-Performance Thermal Interface Assembly between Printed Circuit Board and Heat-sink

被引：0

作者：

Degrenne, Nicolas ^{[1
]}

Mollov, Stefan ^{[1
]}

机构：

[1] Mitsubishi Elect R&D Ctr Europe MERCE, 1 Allee Beaulieu, Rennes, France

来源：

2017 19TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'17 ECCE EUROPE) | 2017年

关键词：

Thermal design; Cooling; Insulation; System integration; Photovoltaic;

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

This paper presents a new and low-cost thermal interface assembly between a printed circuit board and a heat-sink that provides electric isolation on the whole surface, and thermal conduction where needed. The assembly relies on the association of an isolation and a spacer layer and a thermo-conductive gel. The bill of material is 8 times lower than a best in class thermal pad, and equivalent thermal resistance is 30% lower.

引用

页数：6