Strain in hydrogen and oxygen implanted silicon and SOI structures annealed at high pressure

被引:5
作者
Bak-Misiuk, J
Antonova, IV
Misiuk, A
Domagala, J
Popov, VP
Obodnikov, VI
Härtwig, J
Romano-Rodriguez, A
机构
[1] Polish Acad Sci, Inst Phys, PL-02668 Warsaw, Poland
[2] Russian Acad Sci, Inst Semicond Phys, Novosibirsk 630090, Russia
[3] Inst Electr Mat Technol, PL-02668 Warsaw, Poland
[4] European Synchrotron Radiat Facil, F-38043 Grenoble, France
[5] Univ Barcelona, E-08028 Barcelona, Spain
关键词
silicon-on-insulator (SOI); silicon; hydrogen; oxygen;
D O I
10.1016/S0925-8388(01)01344-5
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Effect of annealing up to 1400 K under argon pressure up to 1.2 GPa (HT-HP treatment) on silicon implanted with hydrogen (Si:H), oxygen (Si:O) and on silicon-on-insulator (SOI) structure was investigated by X-ray methods and transmission electron microscopy (TEM). The results obtained for the HT-HP treated samples were compared with that for the samples annealed at atmospheric pressure (10(5) Pa). For Si:H and Si:O samples the HT-HP treatment influences strain state of the Si top laver much stronger than annealing at atmospheric pressure. The pressure treatment prohibits the hydrogen diffusion towards the surface region. The as-bonded SOI structures indicated presence of hydrogen and defects. The mosaic-like structure with high defect concentration was observed also for SOI treated at 1370 K-1.2 GPa, while annealing at 10(5) Pa resulted in improved perfection of the Si top laver. (C) 2001 Elsevier Science BY. All rights reserved.
引用
收藏
页码:181 / 186
页数:6
相关论文
共 8 条
[1]   X-ray reflectivity of ultrathin twist-bonded silicon wafers [J].
Eymery, J ;
Fournel, F ;
Rieutord, F ;
Buttard, D ;
Moriceau, H ;
Aspar, B .
APPLIED PHYSICS LETTERS, 1999, 75 (22) :3509-3511
[2]  
JIANO J, 2000, MAT SCI ENG B, V72, P150
[3]   Hydrogen induced silicon surface layer cleavage [J].
Lu, X ;
Cheung, NW ;
Strathman, MD ;
Chu, PK ;
Doyle, B .
APPLIED PHYSICS LETTERS, 1997, 71 (13) :1804-1806
[4]   Effect of external stress applied during annealing on hydrogen- and oxygen-implanted silicon [J].
Misiuk, A ;
Surma, HB ;
Antonova, IV ;
Popov, VP ;
Bak-Misiuk, J ;
Lopez, M ;
Romano-Rodriguez, A ;
Barcz, A ;
Jun, J .
SOLID STATE PHENOMENA, 1999, 70 :345-350
[5]   Effect of external stress on creation of buried SiO2 layer in silicon implanted with oxygen [J].
Misiuk, A ;
Barcz, A ;
Ratajczak, J ;
Lopez, M ;
Romano-Rodriguez, A ;
Bak-Misiuk, J ;
Surma, HB ;
Jun, J ;
Antonova, IV ;
Popov, VP .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2000, 73 (1-3) :134-138
[6]  
Misiuk A, 1999, PHYS STATUS SOLIDI A, V171, P191, DOI 10.1002/(SICI)1521-396X(199901)171:1<191::AID-PSSA191>3.0.CO
[7]  
2-Y
[8]  
Popov VP, 2000, NATO ASI 3 HIGH TECH, V73, P47