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Growth of a dry spot under a vapor bubble at high heat flux and high pressure
被引:38
|作者:
Nikolayev, VS
Beysens, DA
Lagier, GL
Hegseth, J
机构:
[1] CEA, ESEME, Serv Basses Temp, F-38054 Grenoble 9, France
[2] CEA, SMTH, Lab Thermohydraul Avancee, F-38054 Grenoble 9, France
[3] Univ New Orleans, Dept Phys, New Orleans, LA 70148 USA
关键词:
boiling;
bubble growth;
CHF;
contact angle;
vapor recoil;
D O I:
10.1016/S0017-9310(01)00024-2
中图分类号:
O414.1 [热力学];
学科分类号:
摘要:
We report a 2D modeling of the thermal diffusion-controlled growth of a vapor bubble attached to a heating surface during saturated boiling. The heat conduction problem is solved in a liquid that surrounds a bubble with a free boundary and in a semi-infinite solid heater by the boundary element method. At high system pressure the bubble is assumed to grow slowly, its shape being defined by the surface tension and the vapor recoil force, a force coming from the liquid evaporating into the bubble. It is shown that at some typical time the dry spot under the bubble begins to grow rapidly under the action of the vapor recoil. Such a bubble can eventually spread into a vapor film that can separate the liquid from the heater thus triggering the boiling crisis (critical heat flux). (C) 2001 Elsevier Science Ltd. All rights reserved.
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页码:3499 / 3511
页数:13
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