New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties

被引:12
作者
Geraud, D [1 ]
Magbitang, T [1 ]
Volksen, W [1 ]
Simonyi, EE [1 ]
Miller, RD [1 ]
机构
[1] IBM Corp, Almaden Res Ctr, San Jose, CA 95120 USA
来源
PROCEEDINGS OF THE IEEE 2005 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2005年
关键词
D O I
10.1109/IITC.2005.1499991
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Bridged oxycarbosilane monomers are excellent precursors for the formation of spin on porous low-k materials using sacrificial pore generators. The measured Young's modulus numbers for the as-synthesized thin films without any post porosity toughening are the highest by far of any that we have observed for porous films generated using the sacrificial porogen route. For a given dielectric constant, the Young's modulus of these oxycarbosilane films are 4-5 times higher than available organosilicates and at least 2 times higher than UV treated organosilicate materials.
引用
收藏
页码:226 / 228
页数:3
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