Correlation between Process Parameters and Electrochemical Surface State for Electrochemical-mechanical Polishing Application of Copper in Acid- and Alkali-based Electrolyte

被引：8

作者：

Lee, Youngkyun ^{[1
]}

Seo, Yong-Jin ^{[2
]}

Yang, Jun-Won ^{[3
]}

Kim, Hyung-Ho ^{[3
]}

Park, Yeongbong ^{[1
]}

Jeong, Haedo ^{[1
]}

机构：

[1] Pusan Natl Univ, Grad Sch Mech Engn, Pusan 609735, South Korea

[2] Daebul Univ, Nano Informat Mat & Devices Lab, Chungnam 526702, South Korea

[3] Daebul Univ, Dept Comp Educ, Chungnam 526702, South Korea

来源：

ELECTRONIC MATERIALS LETTERS | 2012年 / 8卷 / 01期

基金：

新加坡国家研究基金会;

关键词：

chemical mechanical polishing (CMP); electrochemical-mechanical polishing (ECMP); current-voltage (I-V); linear sweep voltammetry (LSV); electrolyte; Cu electrode; GALVANIC CORROSION; PLANARIZATION; SLURRY; GLYCINE; CMP; TECHNOLOGY; REMOVAL;

D O I：

10.1007/s13391-011-1000-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We examine the correlation between process parameters and electrochemical surface state for electrochemical-mechanical polishing (ECMP) application of copper (Cu) in alkali-based NaNO3 and acid-based HNO3 electrolyte. First, the effects of electrolyte concentration on the electrochemical surface reaction of Cu electrode were evaluated from the current-voltage (I-V) curve obtained by linear sweep voltammetry (LSV) method. Second, we fundamentally studied the chemical states and element composition of the Cu surface according to the concentration of the electrolyte and the potential variation using scanning electron spectroscopy (SEM) and X-ray diffraction (XRD) patterns. The proposed mechanism and analyses were a good methodology in finding suitable electrochemical process parameter for ECMP application.

引用

页码：81 / 85

页数：5

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