A Flexible, Heterogeneously Integrated Wireless Powered System for Bio-Implantable Applications using Fan-Out Wafer-Level Packaging

被引：0
|
作者：
Ezhilarasu, G. [1 ]
Hanna, A. [1 ]
Irwin, R. [1 ]
Alam, A. [1 ]
Iyer, S. S. [1 ]
机构：
[1] Univ Calif Los Angeles, Dept Elect Engn, Ctr Heterogeneous Integrat & Performance Scaling, Los Angeles, CA 90095 USA
来源：
2018 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2018年
关键词：
COMMUNICATION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Fan-Out Wafer-Level Packaging (FOWLP) is used to fabricate a near field wireless implantable system on an ultra-flexible (similar to 5mm bending radius) & biocompatible elastomeric substrate. A mu LED is powered wirelessly with an efficiency > 15% @ 1cm transmit distance. The implantable system is only similar to 535 mu m thick with a diameter <2cm.
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页数：4
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