Some problems on modeling of interface fracture

被引:0
|
作者
Goldstein, RV
机构
关键词
interface crack; layered plate; bond; adhesion fracture resistance;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Modeling of an interface crack limit equilibrium and growth was performed by the author and his colleagues during the lasts years. The paper is mainly based on these results. An asymptotic approach for calculation of the stress state near the contour of a delamination of an arbitrary shape in plan at an interface of a two-layered structural element was developed. Using the method of matched asymptotic expansions enabled to construct an effective procedure for calculation of the stress intensity factors at the crack contour on the basis of the plate theory taking into account 3D effects near the crack contour caused by the influence of the external boundaries of the bi-material element. A bridged interface crack model was suggested for modeling and evaluation of the adhesion fracture resistance of an interface. Bond stresses were searched for by numerical solving a derived system of two singular integro-differential equations. An analysis of the limit force and energetic characteristics in the crack end region was performed in assumption of the linear elastic behavior of the bonds.
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页码:2369 / 2375
页数:7
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