Study of Nonequilibrium Solidification Region in Sn96.5Ag3Cu0.5 Alloys with Carbon Nanotube Admixtures by Electrical Resistivity Measurements

被引：3

作者：

Plevachuk, Yu. ^{[1
]}

Tkach, O. ^{[1
]}

Svec, P., Sr. ^{[2
]}

Svec, P. ^{[2
]}

机构：

[1] Ivan Franko Natl Univ Lviv, Dept Met Phys, UA-79005 Lvov, Ukraine

[2] Slovak Acad Sci, Inst Phys, Bratislava 84511, Slovakia

来源：

JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION | 2019年 / 40卷 / 01期

关键词：

carbon nanotubes; electrical resistivity; lead-free solder; melting-solidification; nonequilibrium solidification; SAC305; SN-AG-CU; MECHANICAL-PROPERTIES; SOLDER JOINTS; NI NANOPARTICLES; MICROSTRUCTURE; RELIABILITY;

D O I：

10.1007/s11669-019-00706-2

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A melting-solidification region of nanocomposites based on Sn96.5Ag3Cu0.5 (SAC305) alloys with minor admixtures of carbon nanotubes (from 0.005 to 0.03wt.%) was studied by electrical resistivity measurements using a four-probe method. The samples were produced by planar flow casting technique in the form of thin ribbons. Temperature dependencies of the electrical resistivity revealed a hysteresis between the heating and cooling curves in the melting-solidification temperature range due to the nonequilibrim solidification. An influence of the carbon nanotubes content on electrical resistivity values has been analyzed.

引用

页码：86 / 92

页数：7

共 30 条

[1] Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn-Ag-Cu solder alloy [J].

Amin, Nur Aishah Aminah Mohd ;

Shnawah, Dhafer Abdulameer ;

Said, Suhana Mohd ;

Sabri, Mohd Faizul Mohd ;

Arof, Hamzah .

JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 599 :114-120

[2] Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications [J].

Anderson, Iver E. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :55-76

[3]

[Anonymous], PHASE TRANSITIONS PU

[4] Processing of carbon nanotube reinforced silicon nitride composites by spark plasma sintering [J].

Balázsi, C ;

Shen, Z ;

Kónya, Z ;

Kasztovszky, Z ;

Wéber, F ;

Vértesy, Z ;

Biró, LP ;

Kiricsi, I ;

Arató, P .

COMPOSITES SCIENCE AND TECHNOLOGY, 2005, 65 (05) :727-733

[5] Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping [J].

Bashir, M. Nasir ;

Haseeb, A. S. M. A. ;

Rahman, Abu Zayed Mohammad Saliqur ;

Fazal, M. A. ;

Kao, C. R. .

JOURNAL OF MATERIALS SCIENCE, 2015, 50 (20) :6748-6756

[6] Effects of diamond nanoparticles reinforcement into lead-free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process [J].

Chellvarajoo, Srivalli ;

Abdullah, M. Z. ;

Khor, C. Y. .

MATERIALS & DESIGN, 2015, 82 :206-215

[7] Lowering of Sn-Sb alloy melting points caused by substrate dissolution [J].

Chen, Sinn-Wen ;

Chen, Po-Yin ;

Wang, Chao-Hong .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (11) :1982-1985

[8] Pecularities of electrical resistivity during transformations in amorphous and nanocrystalline alloys [J].

Deanko, M. ;

Paluga, M. ;

Kepaptsoglou, D. M. ;

Muller, D. ;

Mrafko, P. ;

Janickovic, D. ;

Hristoforou, E. ;

Skorvanek, I. ;

Svec, P. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 434 :248-251

[9] The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness Of Sn-Ag-Cu solder on OSP-Cu pads [J].

Gain, Asit Kumar ;

Chan, Y. C. .

INTERMETALLICS, 2012, 29 :48-55

[10] Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems [J].

Giuranno, Donatella ;

Delsante, Simona ;

Borzone, Gabriella ;

Novakovic, Rada .

JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 689 :918-930

← 1 2 3 →