Analysis of Roughness in Super-high Speed Point Grinding

被引：0

作者：

Liu, Yueming ^{[1
]}

Gong, Yadong ^{[1
]}

Cheng, Jun ^{[1
]}

Han, Tingchao ^{[1
]}

机构：

[1] Northeastern Univ, Sch Mech Engn & Automat, Shenyang, Peoples R China

来源：

ADVANCES IN ABRASIVE TECHNOLOGY XIII | 2010年 / 126-128卷

关键词：

Roughness; Super-high speed point grinding; Swivel angle; Contact area; Probability distribution of chip thickness; SURFACE;

D O I：

10.4028/www.scientific.net/AMR.126-128.101

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The technology of super-high speed point (SHSP) grinding will bring in higher precision and productivity for component manufacturing. The surface roughness attained by SHSP grinding is analyzed in this paper based on the contact area and the probability distribution of chip thickness while the swivel angle of a exists, proposing a new method to predicate the value of the roughness, the experiment of SHSP grinding is carried out whether a exists or not to verify the theoretical analysis in the paper, through observing the micro-surface after grinding, the conclusions will be drawn at last.

引用

页码：101 / 106

页数：6

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