WIRELESS CAPACITIVE PRESSURE SENSOR WITH DIRECTIONAL RF CHIP ANTENNA FOR HIGH TEMPERATURE ENVIRONMENTS

被引:0
作者
Scardelletti, M. C. [1 ]
Jordan, J. L. [1 ]
Ponchak, G. E. [1 ]
Zorman, C. A. [2 ]
机构
[1] NASA, Glenn Res Ctr, Cleveland, OH USA
[2] Case Western Reserve Univ, Cleveland, OH USA
来源
2015 IEEE INTERNATIONAL CONFERENCE ON WIRELESS FOR SPACE AND EXTREME ENVIRONMENTS (WISEE) | 2015年
关键词
Wireless capacitive pressure sensor system; MEMS; chip antenna; passive and active components; high temperature applications; health monitoring;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the design, fabrication and characterization of a wireless capacitive pressure sensor with directional RF chip antenna that is envisioned for the health monitoring of aircraft engines operating in harsh environments. The sensing system is characterized from room temperature (25 degrees C) to 300 degrees C for a pressure range from 0 to 100 psi. The wireless pressure system consists of a Clapp-type oscillator design with a capacitive MEMS pressure sensor located in the LC-tank circuit of the oscillator. Therefore, as the pressure of the aircraft engine changes, so does the output resonant frequency of the sensing system. A chip antenna is integrated to transmit the system output to a receive antenna 10 m away. The design frequency of the wireless pressure sensor is 127 MHz and a 2% increase in resonant frequency over the temperature range of 25 to 300 degrees C from 0 to 100 psi is observed. The phase noise is less than-30 dBc/Hz at the 1 kHz offset and decreases to less than-80 dBc/Hz at 10 kHz over the entire temperature range. The RF radiation patterns for two cuts of the wireless system have been measured and show that the system is highly directional and the MEMS pressure sensor is extremely linear from 0 to 100 psi.
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页数:6
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共 12 条
  • [1] Behbahani A. R., 2006, AFRLPRWPTP2007217
  • [2] A Minimally Invasive Implantable Wireless Pressure Sensor for Continuous IOP Monitoring
    Chitnis, Girish
    Maleki, Teimour
    Samuels, Brian
    Cantor, Louis B.
    Ziaie, Babak
    [J]. IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, 2013, 60 (01) : 250 - 256
  • [3] Culley D. E., 2007, 2007214994 NASA TM
  • [4] Goldstein B. A., 2009, 34 WORKSH GEOTH RES
  • [5] The changing automotive environment: High-temperature electronics
    Johnson, RW
    Evans, JL
    Jacobsen, P
    Thompson, JRR
    Christopher, M
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2004, 27 (03): : 164 - 176
  • [6] LITT JS, 2005, NASATM2005213622
  • [7] Ponchak GE, 2010, ASIA PACIF MICROWAVE, P1027
  • [8] High Temperature Characteristics of Coplanar Waveguide on R-Plane Sapphire and Alumina
    Ponchak, George E.
    Jordan, Jennifer L.
    Scardelletti, Maximilian C.
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (01): : 146 - 151
  • [9] Scardelletti M. C., 2007, IEEE ANT PROP C JUN, P3800
  • [10] Scardelletti MC, 2014, IEEE TOPIC CONF WIRE, P34, DOI 10.1109/WiSNet.2014.6825503