Electron energy distributions and electron impact source functions in Ar/N2 inductively coupled plasmas using pulsed power

被引:17
作者
Logue, Michael D. [1 ]
Kushner, Mark J. [1 ]
机构
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
基金
美国国家科学基金会;
关键词
ARGON; CHLORINE; GASES; ATOMS;
D O I
10.1063/1.4904935
中图分类号
O59 [应用物理学];
学科分类号
摘要
In plasma materials processing, such as plasma etching, control of the time-averaged electron energy distributions (EEDs) in the plasma allows for control of the time-averaged electron impact source functions of reactive species in the plasma and their fluxes to surfaces. One potential method for refining the control of EEDs is through the use of pulsed power. Inductively coupled plasmas (ICPs) are attractive for using pulsed power in this manner because the EEDs are dominantly controlled by the ICP power as opposed to the bias power applied to the substrate. In this paper, we discuss results from a computational investigation of EEDs and electron impact source functions in low pressure (5-50 mTorr) ICPs sustained in Ar/N-2 for various duty cycles. We find there is an ability to control EEDs, and thus source functions, by pulsing the ICP power, with the greatest variability of the EEDs located within the skin depth of the electromagnetic field. The transit time of hot electrons produced in the skin depth at the onset of pulse power produces a delay in the response of the EEDs as a function of distance from the coils. The choice of ICP pressure has a large impact on the dynamics of the EEDs, whereas duty cycle has a small influence on time-averaged EEDs and source functions. (C) 2015 AIP Publishing LLC.
引用
收藏
页数:14
相关论文
共 24 条
[1]   Pulsed high-density plasmas for advanced dry etching processes [J].
Banna, Samer ;
Agarwal, Ankur ;
Cunge, Gilles ;
Darnon, Maxime ;
Pargon, Erwine ;
Joubert, Olivier .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2012, 30 (04)
[2]   Control of the plasma chemistry of a pulsed inductively coupled methane plasma [J].
Bauer, M ;
Schwarz-Selinger, T ;
Kang, HD ;
von Keudell, A .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 2005, 14 (03) :543-548
[3]   Analysis of pulsed high-density HBr and Cl2 plasmas: Impact of the pulsing parameters on the radical densities [J].
Bodart, P. ;
Brihoum, M. ;
Cunge, G. ;
Joubert, O. ;
Sadeghi, N. .
JOURNAL OF APPLIED PHYSICS, 2011, 110 (11)
[4]   DEEXCITATION CROSS-SECTIONS OF METASTABLE ARGON BY VARIOUS ATOMS AND MOLECULES [J].
BOURENE, M ;
LECALVE, J .
JOURNAL OF CHEMICAL PHYSICS, 1973, 58 (04) :1452-1458
[5]   Plasma etching: principles, mechanisms, application to micro- and nano-technologies [J].
Cardinaud, C ;
Peignon, MC ;
Tessier, PY .
APPLIED SURFACE SCIENCE, 2000, 164 :72-83
[6]   Measurement of free radical kinetics in pulsed plasmas by UV and VUV absorption spectroscopy and by modulated beam mass spectrometry [J].
Cunge, G. ;
Bodart, P. ;
Brihoum, M. ;
Boulard, F. ;
Chevolleau, T. ;
Sadeghi, N. .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 2012, 21 (02)
[7]   Pulsed plasma etching for semiconductor manufacturing [J].
Economou, Demetre J. .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2014, 47 (30)
[8]   Modeling and simulation of plasma etching reactors for microelectronics [J].
Economou, DJ .
THIN SOLID FILMS, 2000, 365 (02) :348-367
[9]   Electron energy distribution function measurements and plasma parameters in inductively coupled argon plasma [J].
Godyak, VA ;
Piejak, RB ;
Alexandrovich, BM .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 2002, 11 (04) :525-543
[10]   Nonequilibrium EEDF in gas discharge plasmas [J].
Godyak, Valery A. .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2006, 34 (03) :755-766