Microstructural development of Sn-Ag-Cu solder joints

被引：35

作者：

Fix, AR ^{[1
]}

López, GA

Brauer, I

Nüchter, W

Mittemeijer, EJ

机构：

[1] Robert Bosch GmbH, PLV3, FV, D-70442 Stuttgart, Germany

[2] Max Planck Inst Met Res, D-70569 Stuttgart, Germany

[3] Univ Stuttgart, Inst Phys Met, D-70569 Stuttgart, Germany

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2005年 / 34卷 / 02期

关键词：

lead-free solder; influence of metallization; intermetallics; diffusion; phase growth; Sn-Ag-Cu;

D O I：

10.1007/s11664-005-0224-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of Cu as pad material and of the metallization of pad (with Sn) and component (with Ni) on the evolving microstructure of lead-free solder joints were studied. A solder paste with composition 95.5wt.%Sn-4.Owt.%Ag-0.5wt.%Cu was used. Partial dissolution of the Cu substrate led to a change in the overall composition of the solder, which caused a precipitation morphology different from the one expected regarding the initial composition. Kinetics of growth of the CU6Sn5 phase, as particles in the bulk of the solder and as a reaction layer adjacent to the Cu pad, was studied in the temperature range 125-175degreesC.

引用

页码：137 / 142

页数：6

共 20 条

[1] Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging [J].

Ahat, S ;

Sheng, M ;

Luo, L .

JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (10) :1317-1322

[2] Effects of alloying in near-eutectic tin-silver-copper solder joints [J].

Anderson, IE ;

Cook, BA ;

Harringa, J ;

Terpstra, RL ;

Foley, JC ;

Unal, O .

MATERIALS TRANSACTIONS, 2002, 43 (08) :1827-1832

[3] Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure [J].

Chada, S ;

Fournelle, RA ;

Laub, W ;

Shangguan, D .

JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) :1214-1221

[4]

GLEITER H, 1983, MICROSTRUCTURE PHYS, P682

[5] Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys [J].

Henderson, DW ;

Gosselin, T ;

Sarkhel, A ;

Kang, SK ;

Choi, WK ;

Shih, DY ;

Goldsmith, C ;

Puttlitz, KJ .

JOURNAL OF MATERIALS RESEARCH, 2002, 17 (11) :2775-2778

[6] Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni [J].

Ho, CE ;

Tsai, RY ;

Lin, YL ;

Kao, CR .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (06) :584-590

[7] Interactions between solder and metallization during long-term aging of advanced microelectronic packages [J].

Ho, CE ;

Chen, WT ;

Kao, CR .

JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (04) :379-385

[8] Microstructure coarsening during static annealing of 60Sn4OPb solder joints: II eutectic coarsening kinetics [J].

Jung, K ;

Conrad, H .

JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (10) :1303-1307

[9] Intermetallic compound layer formation between Sn-3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni-P/Cu) substrate [J].

Lee, CB ;

Yoon, JW ;

Suh, SJ ;

Jung, SB ;

Yang, CW ;

Shur, CC ;

Shin, YE .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2003, 14 (08) :487-493

[10] Formation of intermetallic compounds in SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization [J].

Lee, KY ;

Li, M .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2001, 32 (10) :2666-2668

← 1 2 →